中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



全部

1995 1996 1997 1998 1999 2000
2001 2002 2003 2004 2005 2006
2007 2008 2009 2010 2011 2012
2013 2014 2015 2016 2017 2018
2019 2020 2021 2022 2023 2024

2021, vol.143, no.1 2021, vol.143, no.2 2021, vol.143, no.3 2021, vol.143, no.4

题名作者出版年年卷期
Heat Transfer Enhancement Through Array Jet Impingement on Strategically Placed High Porosity High Pore-Density Thin Copper FoamsRajamuthu, Varun Prasanna; Panse, Sanskar S.; Ekkad, Srinath20212021, vol.143, no.3
Flow-Controlled Spray Cooling Approaches for Dynamic Thermal ManagementBostanci, Huseyin; Yata, Vishnu V. R.; Kaluvan, Suresh20212021, vol.143, no.3
Compact Transient Thermal Model of Microfluidically Cooled Three-Dimensional Stacked Chips With Pin-Fin Enhanced MicrogapHu, Yuanchen; Hossen, Md Obaidul; Wan, Zhimin; Bakir, Muhannad S.; Joshi, Yogendra20212021, vol.143, no.3
Influence of Carbon Nanoparticles Additives on Nanosilver Joints in LTJT TechnologySzalapak, Jerzy; Kielbasinski, Konrad; Dybowska-Sarapuk, Lucja; Krzeminski, Jakub; Teodorczyk, Marian; Kowaluk, Tomasz; Jakubowska, Malgorzata20212021, vol.143, no.3
Influences of Small Jet-to-Wall Spacings on Heat Transfer Characteristics and Flow-Field Entrainment Effects of Microscale JetsSubrahmanyam, Prabhakar; Gnanavel, B. K.20212021, vol.143, no.3
Experimental Characterization of Two-Phase Cooling of Power Electronics in Thermosiphon and Forced Convection ModesBattaglia, Fabio; Singer, Farah; Deisenroth, David C.; Ohadi, Michael M.20212021, vol.143, no.3
A Review of Thermo-Hydraulic Performance of Metal Foam and Its Application as Heat Sinks for Electronics CoolingGong, Liang; Xu, Minghai; Joshi, Yogendra; Li, Yongtong20212021, vol.143, no.3
Design, Fabrication, and Testing of a Novel Design for Flexible Light-Emitting Diode Signage ModulesAdhikari, Ram C.; Beyragh, Dawood S.; Pahlevani, Majid20212021, vol.143, no.3
Design and Optimization of Control Strategy to Reduce Pumping Power in Dynamic Liquid CoolingKasukurthy, Rajesh; Rachakonda, Amruthavalli; Agonafer, Dereje20212021, vol.143, no.3
Study of Different Dispensing Patterns of No-Flow Underfill Using Numerical and Experimental MethodsAli, M. Yusuf Tura; Samsudin, Z.; Nashrudin, Muhammad Naqib; Abas, Aizat; Abdullah, M. Z.20212021, vol.143, no.3
12



国家科技图书文献中心  全球文献资源网  京ICP备05055788号-26  京公网安备11010202008970号  机械工业信息研究院 2018-2024