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期刊
ISSN
0954-0911
刊名
Soldering & Surface Mount Technology
参考译名
焊接与表面固定技术
收藏年代
1999~2024
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2022, vol.34, no.1
2022, vol.34, no.2
2022, vol.34, no.3
2022, vol.34, no.4
2022, vol.34, no.5
题名
作者
出版年
年卷期
Reliability modeling and assessment of solder joints of electronic assemblies under mixed exposure to mechanical loads
Supriyono; Chen, Tzu-Chia; Yapanto, Lis M.; Zekiy, Angelina Olegovna; Melnikova, Lyubov A.; Thangavelu, Lakshmi; Surendar, A.; Repnikov, Nikolay I.; Arzehgar, Zeinab; Latipov, Zagir Azgarovich
2022
2022, vol.34, no.1
Model updating of a temperature field simulation of a printed circuit board assembly based on the Kriging model
Yin, Yutian; Zhou, Hongda; Chen, Cai; Zheng, Yi; Shen, Hongqiao; Gong, Yubing
2022
2022, vol.34, no.1
Accurate composition dependent thermo mechanical lifetime estimation of hour glass type solder joint in electronic assemblies
Olenev, Leonid Anatolevich; Zakieva, Rafina Rafkatovna; Smirnova, Nina Nikolaevna; Shichiyakh, Rustem Adamovich; Ershov, Kirill Aleksandrovich; Geetha, Nisith
2022
2022, vol.34, no.1
Effect of microwave operating power and reflow time on the microstructure and tensile properties of Sn-3.0Ag-0.5Cu/Cu solder joints
Said, Mardiana; Mohd Nazeri, Muhammad Firdaus; Mohd Sharif, Nurulakmal; Mohamad, Ahmad Azmin
2022
2022, vol.34, no.1
Local solidification thermal parameters affecting the eutectic extent in Sn-Cu and Sn-Bi solder alloys
Kakitani, Rafael; Pinto da Silva, Cassio Augusto; Silva, Bismarck; Garcia, Amauri; Cheung, Noe; Spinelli, Jose Eduardo
2022
2022, vol.34, no.1
Electronic component detection based on image sample generation
Wu, Hao; Lv, Quanquan; Yang, Jiankang; Yan, Xiaodong; Xu, Xiangrong
2022
2022, vol.34, no.1
Experimental measurements of the shear force on surface mount components simulating the wave soldering process
Carvalho, Violeta; Arcipreste, Bruno; Soares, Delfim; Ribas, Luis; Rodrigues, Nelson; Teixeira, Senhorinha; Teixeira, Jose C.
2022
2022, vol.34, no.1
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