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期刊
ISSN
0954-0911
刊名
Soldering & Surface Mount Technology
参考译名
焊接与表面固定技术
收藏年代
1999~2024
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2022, vol.34, no.1
2022, vol.34, no.2
2022, vol.34, no.3
2022, vol.34, no.4
2022, vol.34, no.5
题名
作者
出版年
年卷期
Wetting characteristics of Sn-5Sb-CuNiAg lead-free solders on the copper substrate
Wang Xiuqi; Sun Fenglian; Han Bangyao; Cao Yilun; Du Jinyang; Liu Guohuai; Shao Long
2022
2022, vol.34, no.2
Effect of external static magnetic field on the particle distribution, the metallurgical process and the microhardness of Sn3.5Ag solder with magnetic Ni particles
Wang Jianhua; Xu Hongbo; Zhou Li; Liu Ximing; Zhao Hongyun
2022
2022, vol.34, no.2
Defect patterns study of pick-and-place machine using automated optical inspection data
He Jingxi; Won Daehan; Cen Yuqiao
2022
2022, vol.34, no.2
Effects of doping trace Ni element on interfacial behavior of Sn/Ni (polycrystal/single-crystal) joints
Wang Jianing; Chen Jieshi; Zhang Zhiyuan; Zhang Peilei; Yu Zhishui; Zhang Shuye
2022
2022, vol.34, no.2
Microstructures evolution and growth kinetics of intermetallic compounds in Cu/Sn/Cu system during ultrasonic soldering process
Han Xu; Li Xiaoyan; Yao Peng
2022
2022, vol.34, no.2
Influence of moisture concentration and hydrophobic material on induced stress in FCBGA package under reflow
Heng Elwin; Abdullah Mohd Zulkifly
2022
2022, vol.34, no.2
Effect of different soldering temperatures on the properties of COB light source
Wang Zhao; Li Yuefeng; Zou Jun; Yang Bobo; Shi Mingming
2022
2022, vol.34, no.2
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