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期刊
ISSN
0954-0911
刊名
Soldering & Surface Mount Technology
参考译名
焊接与表面固定技术
收藏年代
1999~2024
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2022, vol.34, no.1
2022, vol.34, no.2
2022, vol.34, no.3
2022, vol.34, no.4
2022, vol.34, no.5
题名
作者
出版年
年卷期
Impact of different aging conditions on the IMC layer growth and shear strength of Ni-modified MWCNTs reinforced Sn-Ag-Cu composite solder
Zhai, Xinmeng; Chen, Yue; Li, Yuefeng
2022
2022, vol.34, no.3
Microstructural and compositional evolution of SAC305/TiN composite solder under thermal stressing
Chen, Guang; Wu, Yao-Feng
2022
2022, vol.34, no.3
Effects of Sn-Ag-x leveling layers on the microstructure and mechanical properties of SnBi low-temperature solder joints
Liu, Yang; Xue, Yuxiong; Zhou, Min; Cao, Rongxing; Zeng, Xianghua; Li, Hongxia; Zheng, Shu; Zhang, Shuang
2022
2022, vol.34, no.3
Design criteria for pad and stencil with high pick-and-Place yield
Huang, Chien-Yi; Chan, Chao-Chieh; Wang, Ping-Sen; Greene, Christopher
2022
2022, vol.34, no.3
Cu3Sn-microporous copper composite joint for high-temperature die-attach applications
Pan, Zhen; Sun, Fenglian
2022
2022, vol.34, no.3
A study on the effects of electrical and thermal stresses on void formation and migration lifetime of Sn3.0Ag0.5Cu solder joints
Li, Yanruoyue; Fu, Guicui; Wan, Bo; Wu, Zhaoxi; Yan, Xiaojun; Zhang, Weifang
2022
2022, vol.34, no.3
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