中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2022, vol.144, no.1 2022, vol.144, no.2 2022, vol.144, no.3 2022, vol.144, no.4

题名作者出版年年卷期
Micro Solder Joint Reliability and Warpage Investigations of Extremely Thin Double-Layered Stacked-Chip PackagingLee, Chang-Chun; Kao, Kuo-Shu; Liu, Hou-Chun; Hsieh, Chia-Ping; Chang, Tao-Chih20222022, vol.144, no.1
Sensitivity Coefficient-Based Inverse Heat Conduction Method for Identifying Hot Spots in Electronics Packages: A Comparison of Grid-Refinement MethodsKrane, Patrick; Cuadrado, David Gonzalez; Lozano, Francisco; Paniagua, Guillermo; Marconnet, Amy20222022, vol.144, no.1
Underfill Flow in Flip-Chip Encapsulation Process: A ReviewNg, Fei Chong; Abas, Mohamad Aizat20222022, vol.144, no.1
Fatigue Testing of Copper Nanoparticle-Based Joints and BondsSivasubramony, Rajesh Sharma; Kokash, Mean Zaid; Thekkut, Sanoop; Shahane, Ninad; Thompson, Patrick; Mirpuri, Kabir; Kawana, Yuki; Greene, Christopher M.; Borgesen, Peter20222022, vol.144, no.1
Microstructure and Properties of Nb Nanoparticles Reinforced Sn-0.7Cu Solder AlloyLiu, Zheng; Yang, Li; Xiong, Yifeng; Gao, Huiming20222022, vol.144, no.1
Improving Ambient Contrast Ratio and Color Uniformity of Mini Full Color Light-Emitting Diodes Using an SiO2/Graphite Bilayered Packaging StructureLi, Zong-Tao; Wu, Jun-Hao; Ren, Zhi-yao; Song, Yao-xing; Li, Jia-Sheng20222022, vol.144, no.1
Validation of the Critical Strain-Based Methodology for Evaluating the Mechanical Safety of Ball Grid Array Solder Joints in a Launch Random Vibration EnvironmentPark, Tae-Yong; Oh, Hyun-Ung20222022, vol.144, no.1
Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future DirectionsMoreno, Gilberto; Narumanchi, Sreekant; Feng, Xuhui; Anschel, Paul; Myers, Steve; Keller, Phil20222022, vol.144, no.1
A Review on Transient Thermal Management of Electronic DevicesMathew, John; Krishnan, Shankar20222022, vol.144, no.1
Stochastic Finite Element Thermal Analysis of a Ball Grid Array PackageUpreti, Rahul; Chintamani, Siddarth; Patil, Sandeep; Akbariyeh, Ashkan; Dennis, Brian H.20222022, vol.144, no.1
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