中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2022, vol.144, no.1 2022, vol.144, no.2 2022, vol.144, no.3 2022, vol.144, no.4

题名作者出版年年卷期
Effect of Hexagonal-Boron Nitride/Epoxy and BNNS/Epoxy Composite Materials on the Reliability of Flip ChipLi, Zhankun; Fan, Zhekun; Jin, Zhong; Liu, Zhan; Li, Junhui; Dou, Long20222022, vol.144, no.3
Strength and Isothermal Fatigue Resistance of SnBi/SnAgCu Joints Reflowed at Low TemperaturesAlghoul, Thaer; Thekkut, Sanoop; Das, Ronit; Greene, Christopher; Borgesen, Peter; Sakib, A. R. Nazmus; Wentlent, Luke; Joshi, Shantanu; Yadav, Manu20222022, vol.144, no.3
Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat SinkGharaibeh, Ahmad R.; Manaserh, Yaman M.; Tradat, Mohammad, I; AlShatnawi, Firas W.; Schiffres, Scott N.; Sammakia, Bahgat G.20222022, vol.144, no.3
Effect of Cyclic Stress on Electrochemical Corrosion Behavior of SAC305 SolderChen, G.; Wang, Y. Y.; Wang, X. H.; Cui, Y.; Shi, S. W.; Yang, J.; Xu, W. L.; Lin, Q.20222022, vol.144, no.3
Research on Reliability of Ni/Sn/Cu(Ni) Copper Pillar Bump Under Thermoelectric LoadingDai, Junjie; Zhang, Yuexin; Li, Zhankun; Chen, Mingming; Fan, Zhekun; Li, Junhui; Guo, Yuhua20222022, vol.144, no.3
Experimental and Numerical Analysis of Data Center Pressure and Flow Fields Induced by Backward and Forward CRAH TechnologyTradat, Mohammad, I; Manaserh, Yaman ''Mohammad Ali''; Gharaibeh, Ahmad; Sammakia, Bahgat G.; Hall, Dave; Nemati, Kourosh; Seymour, Mark20222022, vol.144, no.3
Effects of Gaseous and Particulate Contaminants on Information Technology Equipment Reliability-A ReviewSaini, Satyam; Shah, Jimil M.; Shahi, Pardeep; Bansode, Pratik; Singh, Prabjit; Schmidt, Roger; Kaler, Mike; Agonafer, Dereje20222022, vol.144, no.3
A Smart Temperature-Regulating Garment for Portable, High-Efficiency and Comfortable CoolingShu, Weicheng; Zhang, Xinfeng; Yang, Xuan; Luo, Xiaobing20222022, vol.144, no.3
A Hybrid Antenna in Package Solution Using FOWLP TechnologyZhang, Xuesong; Wang, Qian; Wang, Bo; Wang, Gang; Gu, Xin; Chen, Yu; Zhou, Shengjuan; Cai, Jian; Tan, Lin20222022, vol.144, no.3
Inelastic Deformation of Copper Nanoparticle Based Joints and BondsThekkut, Sanoop; Kokash, Maan Zaid; Sivasubramony, Rajesh Sharma; Kawana, Yuki; Mirpuri, Kabir; Shahane, Ninad; Thompson, Patrick; Greene, Christopher M.; Borgesen, Peter20222022, vol.144, no.3
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