中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志;美国机械工程师学会汇刊
收藏年代1995~2024



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2022, vol.144, no.1 2022, vol.144, no.2 2022, vol.144, no.3 2022, vol.144, no.4

题名作者出版年年卷期
Analytical Multi-Parametric Design Optimization for the Miniaturization of Flip-Chip PackageNg, Fei Chong; Abas, Mohamad Aizat20222022, vol.144, no.4
Design and Fabrication of Leadless Package Structure for Pressure SensorsTian, Junwang; Jin, Zhong; Tang, Xin; Peng, Wenxian; Liu, Junfu; Liu, Yunpeng; Chen, Taotao; Xiao, Jinqing; Li, Junhui20222022, vol.144, no.4
Prediction of Board Level Pad Cratering Strength With the Predefined Failure Criteria From Joint Level TestingZhang, Qiming; Lee, S. W. Ricky20222022, vol.144, no.4
Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering ProcessesWang, Xinyue; Zeng, Zejun; Zhang, Guoqi; Zhang, Jing; Liu, Pan20222022, vol.144, no.4
Effect of Wavy Wall and Plate Bifurcations on Heat Transfer Enhancement in MicrochannelKumar, D. Sathish; Jayavel, S.20222022, vol.144, no.4
Design of Microfabricated Mechanically Interlocking Metamaterials for Reworkable Heterogeneous IntegrationGarcia, Geoffrey A.; Wakumoto, Kody; Brown, Joseph J.20222022, vol.144, no.4
Effect of Different Solder Volumes on the Laser Soldering Process: Numerical and Experimental InvestigationBachok, Zuraihana; Abas, Mohamad Aizat; Nazarudin, Muhammad Zaim Hanif; Zahiri, Saifulmajdy A.; Sharif, Mohamad Fikri Mohd; Ani, Fakhrozi Che20222022, vol.144, no.4
Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric CurrentMoriwaki, Takeshi; Fujisaki, Kazuhiro; Saito, Daiki; Sasagawa, Kazuhiko20222022, vol.144, no.4
Heat Transfer Analysis of Supercritical Methane in Microchannels With Different Geometric Configurations on High Power Electromechanical ActuatorGao, Zhigang; Wang, Tianhu; Yang, Yuxin; Shang, Xiaolong; Bai, Junhua; Li, Peng20222022, vol.144, no.4
Design, Development, and Characterization of a Flow Control Device for Dynamic Cooling of Liquid-Cooled ServersShahi, Pardeep; Deshmukh, Apruv Pravin; Hurnekar, Hardik Yashwant; Saini, Satyam; Bansode, Pratik; Kasukurthy, Rajesh; Agonafer, Dereje20222022, vol.144, no.4
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