中国机械工程学会生产工程分会知识服务平台

期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2023, vol.35, no.1 2023, vol.35, no.2 2023, vol.35, no.3 2023, vol.35, no.4 2023, vol.35, no.5

题名作者出版年年卷期
Electrical, morphological, optical and mathematical simulations equations studies in CAZO, CZO, AZO and ZNO filmsDalouji Vali; Rahimi Nasim20232023, vol.35, no.5
Reflow profiling with the aid of machine learning modelsLai Yangyang; Park Seungbae20232023, vol.35, no.5
Data-driven electronic packaging structure inverse design with an adaptive surrogate modelLiu Shaoyi; Xue Song; Lian Peiyuan; Huang Jianlun; Wang Zhihai; Ping Lihao; Wang Congsi20232023, vol.35, no.5
Investigation of moisture-induced crack propagation in the soft-termination multi-layer ceramic capacitor during thermal reflow processBachok Zuraihana; Abas Aizat; Raja Gobal Hehgeraj A/L; Yusoff Norwahida; Ramli Mohamad Riduwan; Mohd Sharif Mohamad Fikri; Che Ani Fakhrozi; Muhamed Mukhtar Muhamed Abdul Fatah20232023, vol.35, no.5
Numerical evaluation of the mechanical response of Sn-Ag-Cu lead-free solders of various silver contentsGharaibeh Mohammad A.; Al-Oqla Faris M.20232023, vol.35, no.5
Interfacial behavior and mechanism of brazed diamond with CeO2-added Ni-Cr filler alloy: a combined first-principles and experimental studyZhang Ao; Zhang Jian; Zhang Mingjun; Liu Junyi; Peng Ping20232023, vol.35, no.5
Early wetting and interfacial behavior of Sn-based solder on copper substrates with different roughnessHan Yuzhu; Chen Jieshi; Zhang Shuye; Yu Zhishui20232023, vol.35, no.5
Drop and impact reliability investigation of BGA and LGA interconnectsGharaibeh, Mohammad A.; Pitarresi, James M.20232023, vol.35, no.4
Wetting kinetics, spreading phenomena and interfacial reaction of Sn-15Bi-xZn solders on Cu substrate at different temperaturesLin, Wei; Li, Xuewen; Tu, Bing; Zhang, Chaohua; Li, Yulong20232023, vol.35, no.4
Role of Cu percentage in the Sn-xCu alloy on the mechanical performance at Sn-xCu/ENIG interface produced by laser solderingAbdullah, Muhammad Asyraf; Idris, Siti Rabiatull Aisha20232023, vol.35, no.4
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