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期刊
ISSN
0954-0911
刊名
Soldering & Surface Mount Technology
参考译名
焊接与表面固定技术
收藏年代
1999~2024
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2024
2023, vol.35, no.1
2023, vol.35, no.2
2023, vol.35, no.3
2023, vol.35, no.4
2023, vol.35, no.5
题名
作者
出版年
年卷期
Parameter optimization for surface mounter using a self-alignment prediction model
Mistry, Maitri; Gupta, Rahul; Jain, Swati; Verma, Jaiprakash V.; Won, Daehan
2023
2023, vol.35, no.2
The impact of intermetallic compound on microstructure, mechanical characteristics, and thermal behavior of the melt-spun Bi-Ag high-temperature lead-free solder
Shalaby, Rizk Mostala; Allzeleh, Musaeed
2023
2023, vol.35, no.2
Thermal aging effects on the properties of the Cu/(SAC0307 powder + Zn-particles)/Cu joint ultrasonic-assisted soldered at low-temperature
Gan, Guisheng; Chen, Shiqi; Jiang, Liujie; Jiang, Zhaoqi; Liu, Cong; Ma, Peng; Cheng, Dayong; Liu, Xin
2023
2023, vol.35, no.2
Mechanical testing and characterization of tin-zinc-antimony-lanthanum lead-free solders produced using mechanical alloying and furnace melting techniques
Ananthapadmanaban, D.; Kathiresan, Arun Vasantha Geethan; Sunderraj, Arthur Jebastine D.
2023
2023, vol.35, no.2
Effect of the IMC layer geometry on a solder joint thermomechanical behavior
Capela, Paulina Araujo; Souza, Maria Sabrina; Costa, Sharlane; Teixeira, Jose C.; Fernandes, Miguel; Figueiredo, Hugo; Delgado, Isabel; Soares, Delfim
2023
2023, vol.35, no.2
Effect of rotating magnetic field on the microstructure and properties of Sn-Ag-Sb lead-free solder alloys
Wang, Zilong; Zhou, JiaCheng; Liu, Fang; Wu, Yuqin; Yan, Nu
2023
2023, vol.35, no.2
Damping properties of Sn58Bi and Sn3.0Ag0.5Cu solders with different thicknesses and preparation directions
Li, Wangyun; Liu, Linyiang; Li, Xingmin
2023
2023, vol.35, no.2
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