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期刊
ISSN
0954-0911
刊名
Soldering & Surface Mount Technology
参考译名
焊接与表面固定技术
收藏年代
1999~2024
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2024
2023, vol.35, no.1
2023, vol.35, no.2
2023, vol.35, no.3
2023, vol.35, no.4
2023, vol.35, no.5
题名
作者
出版年
年卷期
Properties of Cu/SAC0307 mixed solder balls/Cu joints with different Zn-particles content at low-temperature under ultrasonic assisted
Gan, Guisheng; Jiang, Liujie; Liu, Cong; Huang, Tian; Ma, Peng; Cheng, Dayong; Liu, Xin; Chen, Shiqi
2023
2023, vol.35, no.3
A review: effect of copper percentage solder alloy after laser soldering
Abdullah, Asyraf; Aisha Idris, Siti Rabiatull
2023
2023, vol.35, no.3
Influence of aging temperature on the properties of Cu/(SAC0307 powder +Zn-particles)/Al joints ultrasonic-assisted soldered at low temperature
Gan, Guisheng; Chen, Shiqi; Jiang, Liujie; Huang, Tian; Cheng, Dayong; Liu, Xin; Xu, Qianzhu
2023
2023, vol.35, no.3
IC solder joint inspection via adaptive statistical modeling
Xiao, Meng; Cai, Nian; Mo, Zhuokun; Yan, Shule; Tian, Nili; Jing; Wang, Han
2023
2023, vol.35, no.3
ZnO nanoparticles and compositional dependence of structural, thermal, mechanical and electrical properties of eutectic SAC355 lead-free solder
Al-sorory, Hamed; Gumaan, Mohammed S.; Shalaby, Rizk Mostafa
2023
2023, vol.35, no.3
Numerical modelling of the delamination in multi-layered ceramic capacitor during the thermal reflow process
Ng, Fei Chong; Abas, Aizat; Ramli, Mohamad Riduwan; Sharif, Mohamad Fikri Mohd; Ani, Fakhrozi Che
2023
2023, vol.35, no.3
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