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期刊
ISSN
0954-0911
刊名
Soldering & Surface Mount Technology
参考译名
焊接与表面固定技术
收藏年代
1999~2024
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2024
2023, vol.35, no.1
2023, vol.35, no.2
2023, vol.35, no.3
2023, vol.35, no.4
2023, vol.35, no.5
题名
作者
出版年
年卷期
Influence of bonding temperature on the properties of Cu/(SAC mixed powder)/Al joints under ultrasonic-assisted
Gan, Guisheng; Chen, Shi-qi; Liu, Cong; Ma, Peng; Huang, Tian; Cheng, Dayong; Liu, Xin; Jiang, Liujie
2023
2023, vol.35, no.4
Hot tear cracks on the suppression of Sn-Bi alloy for low-temperature assembly
Qu, Songtao; Shi, Qingyu
2023
2023, vol.35, no.4
Introduction of non-linear fracture mechanics in the modelling of a flip-chip component under drop impact
Belhenini, Soufyane; El Fatmi, Imad; Richard, Caroline; Tougui, Abdellah
2023
2023, vol.35, no.4
Role of Cu percentage in the Sn-xCu alloy on the mechanical performance at Sn-xCu/ENIG interface produced by laser soldering
Abdullah, Muhammad Asyraf; Idris, Siti Rabiatull Aisha
2023
2023, vol.35, no.4
Wetting kinetics, spreading phenomena and interfacial reaction of Sn-15Bi-xZn solders on Cu substrate at different temperatures
Lin, Wei; Li, Xuewen; Tu, Bing; Zhang, Chaohua; Li, Yulong
2023
2023, vol.35, no.4
Drop and impact reliability investigation of BGA and LGA interconnects
Gharaibeh, Mohammad A.; Pitarresi, James M.
2023
2023, vol.35, no.4
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