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期刊
ISSN
0954-0911
刊名
Soldering & Surface Mount Technology
参考译名
焊接与表面固定技术
收藏年代
1999~2024
全部
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2024
2023, vol.35, no.1
2023, vol.35, no.2
2023, vol.35, no.3
2023, vol.35, no.4
2023, vol.35, no.5
题名
作者
出版年
年卷期
Early wetting and interfacial behavior of Sn-based solder on copper substrates with different roughness
Han Yuzhu; Chen Jieshi; Zhang Shuye; Yu Zhishui
2023
2023, vol.35, no.5
Interfacial behavior and mechanism of brazed diamond with CeO2-added Ni-Cr filler alloy: a combined first-principles and experimental study
Zhang Ao; Zhang Jian; Zhang Mingjun; Liu Junyi; Peng Ping
2023
2023, vol.35, no.5
Numerical evaluation of the mechanical response of Sn-Ag-Cu lead-free solders of various silver contents
Gharaibeh Mohammad A.; Al-Oqla Faris M.
2023
2023, vol.35, no.5
Investigation of moisture-induced crack propagation in the soft-termination multi-layer ceramic capacitor during thermal reflow process
Bachok Zuraihana; Abas Aizat; Raja Gobal Hehgeraj A/L; Yusoff Norwahida; Ramli Mohamad Riduwan; Mohd Sharif Mohamad Fikri; Che Ani Fakhrozi; Muhamed Mukhtar Muhamed Abdul Fatah
2023
2023, vol.35, no.5
Data-driven electronic packaging structure inverse design with an adaptive surrogate model
Liu Shaoyi; Xue Song; Lian Peiyuan; Huang Jianlun; Wang Zhihai; Ping Lihao; Wang Congsi
2023
2023, vol.35, no.5
Reflow profiling with the aid of machine learning models
Lai Yangyang; Park Seungbae
2023
2023, vol.35, no.5
Electrical, morphological, optical and mathematical simulations equations studies in CAZO, CZO, AZO and ZNO films
Dalouji Vali; Rahimi Nasim
2023
2023, vol.35, no.5
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