中国机械工程学会生产工程分会知识服务平台

期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2024, vol.36, no.1 2024, vol.36, no.2 2024, vol.36, no.3

题名作者出版年年卷期
A temperature control method of hot-bar soldering based on extended Kalman filterZeng, Min; Xie, Jianxing; Li, Zhitao; Wei, Qincheng; Yang, Hui20242024, vol.36, no.3
Electric current stressing enhanced damping properties in Sn5Sb solderLiu, Linqiang; Chen, Feng; Li, Wangyun20242024, vol.36, no.3
Improvement of SAC0307/Cu column friction plunge micro-welding quality by static constraintLi, Zhenkun; Zhao, Zhili; Liu, Jinliang; Ding, Xin20242024, vol.36, no.3
Effect of Ce and Sb doping on microstructure and thermal/mechanical properties of Sn-1.0Ag-0.5Cu lead-free solderLiu, Fang; Wang, Zilong; Zhou, JiaCheng; Wu, Yuqin; Wang, Zhen20242024, vol.36, no.3
A study on the thermomechanical response of various die attach metallic materials of power electronicsGharaibeh, Mohammad A.; Wilde, Juergen20242024, vol.36, no.3
Thermal fatigue life prediction and intermetallic compound behaviour of SAC305 BGA solder joints subject to accelerated thermal cycling testApalowo, Rilwan Kayode; Abas, Mohamad Aizat; Ani, Fakhrozi Che; Mukhtar, Abdul Fatah Muhamed; Ramli, Mohamad Riduwan20242024, vol.36, no.3
Structural, thermal and mechanical properties of rapidly solidified Bi-0.5Ag lead-free solder reinforced Tb rare-earth element for high performance applicationsShalaby, Rizk Mostafa; Saad, Mohamed20242024, vol.36, no.2
A 3D coaxial transition with continuous ground wall fabricated by a 12-inch wafer-level packaging method for radio frequency applicationsZhao, Xinran; Pang, Yingying; Wang, Gang; Xia, Chenhui; Yuan, Yuan; Wang, Chengqian20242024, vol.36, no.2
Anand constitutive modeling of multilayer Silver-Tin transient liquid phase foils using tensile and creep testingGharaibeh, Mohammad A.; Feisst, Markus; Wilde, Juergen20242024, vol.36, no.2
Temperature and current density prediction in solder joints using artificial neural network methodLiu, Yang; Xu, Xin; Lu, Shiqing; Zhao, Xuewei; Xue, Yuxiong; Zhang, Shuye; Li, Xingji; Xing, Chaoyang20242024, vol.36, no.2
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