中国机械工程学会生产工程分会知识服务平台

期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2024, vol.36, no.1 2024, vol.36, no.2 2024, vol.36, no.3

题名作者出版年年卷期
Numerical investigation of thermal fatigue crack growth behavior in SAC305 BGA solder jointsApalowo, Rilwan Kayode; Abas, Mohamad Aizat; Mukhtar, Muhamed Abdul Fatah Muhamed; Ani, Fakhrozi Che; Ramli, Mohamad Riduwan20242024, vol.36, no.2
Low-cycle fatigue life assessment of SAC solder alloy through a FEM-data driven machine learning approachRuiz-Jacinto, Vicente-Segundo; Gutierrez-Valverde, Karina-Silvana; Aslla-Quispe, Abrahan-Pablo; Burga-Falla, Jose-Manuel; Alarcon-Sucasaca, Aldo; Huaman-Romani, Yersi-Luis20242024, vol.36, no.2
The research on the application of self-propagating interconnection technology in silicon optical transceiver module for aerospaceChu, Fei; Chen, Hongzhuan; Zhou, Zheng; Feng, Changlei; Zhang, Tao20242024, vol.36, no.2
Temperature and current density prediction in solder joints using artificial neural network methodLiu, Yang; Xu, Xin; Lu, Shiqing; Zhao, Xuewei; Xue, Yuxiong; Zhang, Shuye; Li, Xingji; Xing, Chaoyang20242024, vol.36, no.2
Anand constitutive modeling of multilayer Silver-Tin transient liquid phase foils using tensile and creep testingGharaibeh, Mohammad A.; Feisst, Markus; Wilde, Juergen20242024, vol.36, no.2
A 3D coaxial transition with continuous ground wall fabricated by a 12-inch wafer-level packaging method for radio frequency applicationsZhao, Xinran; Pang, Yingying; Wang, Gang; Xia, Chenhui; Yuan, Yuan; Wang, Chengqian20242024, vol.36, no.2
Structural, thermal and mechanical properties of rapidly solidified Bi-0.5Ag lead-free solder reinforced Tb rare-earth element for high performance applicationsShalaby, Rizk Mostafa; Saad, Mohamed20242024, vol.36, no.2



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