中国机械工程学会生产工程分会知识服务平台
主页
文献资源
外文期刊
外文会议
中文期刊
专业机构
生产工程
智能制造
高级检索
关于我们
版权声明
使用帮助
期刊
ISSN
1043-7398
刊名
Journal of Electronic Packaging
参考译名
电子封装杂志;美国机械工程师学会汇刊
收藏年代
1995~2024
全部
1995
1996
1997
1998
1999
2000
2001
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2024, vol.146, no.2
题名
作者
出版年
年卷期
Printed Circuit Board Defect Image Recognition Based on the Multimodel Fusion Algorithm
Zhang, Jiantao; Chang, Zhengfang; Xu, Haida; Qu, Dong; Shi, Xinyu
2024
2024, vol.146, no.2
Leadfree SnAgCu Solder Materials Characterization at High Strain Rates at Low Test Temperatures and Drop and Shock Simulation Using Input-G Method
Lall, Pradeep; Yadav, Vikas; Suhling, Jeff; Locker, David
2024
2024, vol.146, no.2
Effect of Differently Shaped Solder Joints of Chip Resistor on Fatigue Life
Ha, Jonghwan; Lai, Yangyang; Yang, Junbo; Yin, Pengcheng; Park, Seungbae
2024
2024, vol.146, no.2
Automotive Silicon Carbide Power Module Cooling With a Novel Modular Manifold and Embedded Heat Sink
Osman, Ammar; Moreno, Gilberto; Myers, Steve; Major, Joshua; Feng, Xuhui; Narumanchi, Sreekant V. J.; Joshi, Yogendra
2024
2024, vol.146, no.2
A Comprehensive Study on Characterization of Residual Stress of Build-Up Layer and Prediction of Chip Warpage
Cai, Chongyang; Wang, Huayan; Yang, Junbo; Yin, Pengcheng; Park, S. B.
2024
2024, vol.146, no.2
Numerical and Experimental Investigation of a Volumetric Resistance Blower Performance and Its Optimization for Portable Computing Device Applications
Kumar, Amit; Majumder, Ayan; Cardenas, Ruander; Macdonald, Mark; Bhattacharya, Anandaroop
2024
2024, vol.146, no.2
Validation and Application of a Finned Tube Heat Exchanger Model for Rack-Level Cooling
Khalid, R.; Youssef, E.; Amalfi, R. L.; Wemhoff, A. P.; Ortega, A.
2024
2024, vol.146, no.2
Hybrid Substrates for Heterogeneous Integration
Lau, John H.; Chen, Gary Chang-Fu; Yang, Channing Cheng-Lin; Teng, Vincent; Peng, Andy Yan-Jia; Huang, Jones Yu-Cheng; Liu, Hsing-Ning; Chen, Y. H.; Tseng, Tzyy-Jang; Li, Ming
2024
2024, vol.146, no.2
The Research for Quickly Measuring the Diameter and Roundness of Solder Balls Based on Machine Vision Technology
Wang, Tongju; Liu, Yahao; Zhang, Wenqian; Lei, Yongping; Lin, Jian; Fu, Hanguang; Lin, Zipeng
2024
2024, vol.146, no.2
Point-Contact Bonding of Integrated Three-Dimensional Manifold Microchannel Cooling Within Direct Bonded Copper Platform
Lin, Yujui; Wei, Tiwei; Moy, Wyatt Jason; Chen, Hao; Gupta, Man Prakash; Degner, Michael; Asheghi, Mehdi; Goodson, Kenneth E.; Mantooth, H. Alan
2024
2024, vol.146, no.2
1
2
国家科技图书文献中心
全球文献资源网
京ICP备05055788号-26
机械工业信息研究院 2018-2024