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期刊

ISSN	0954-0911
刊名	Soldering & Surface Mount Technology
参考译名	焊接与表面固定技术
收藏年代	1999～2024

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2002, vol.14, no.1

2002, vol.14, no.2

2002, vol.14, no.3

题名

作者

出版年

年卷期

Predictive reliability models through validated correlation between power cycling and thermal cycling accelerated life tests

P. Towashiraporn; G. Subbarayan; B. McLlvanie; B. C. Hunter; D. Love; B. Sullivan

2002

2002, vol.14, no.3

Assessment of board level solder joint reliability for PBGA assemblies with lead-free solders

Shi-Wei Ricky Lee; Ben Hoi Wai Lui; Y. H. Kong; Bernard Baylon; Timothy Leung; Pompeo Umali; Hector Agtarap

2002

2002, vol.14, no.3

Fatigue crack growth behavior of lead-containing and lead-free solders

Y. Mutoh; J. Zhao; Y. Miyashita; C. Kanchanomai

2002

2002, vol.14, no.3

Low cycle fatigue and fatigue crack growth behavior of Sn-Ag eutectic solder

C. Kanchanomai; Y. Miyashita; Y. Mutoh; S. L. Mannan

2002

2002, vol.14, no.3

Reactions between Sn-Ag-Cu lead-free solders and the Au/Ni surface finish in advanced electronic packages

L. C. Shiau; C. E. Ho; C. R. Kao

2002

2002, vol.14, no.3

Evaluation of two novel lead-free surface finishes

Richard Ludwig; Ning-Cheng Lee; Chonglun Fan; Yun Zhang

2002

2002, vol.14, no.3

Lead-free solder process implementation for PCB assembly

Peter Collier; Vasudivan Sunappan; Arulvanan Periannan

2002

2002, vol.14, no.3

Degradation of flip-chip-on-glass interconnection with ACF under high humidity and thermal aging

C. M. Lawrence Wu; M. L. Chau

2002

2002, vol.14, no.2

Solder ball failure mechanisms in plastic ball grid array packages

C. H. Zhong; S. Yi; D. C. Whalley

2002

2002, vol.14, no.2

Reliability of tin-lead balled BGAs soldered with lead-free solder paste

Sami Tapani Nurmi; Eero Olavi Ristolainen

2002

2002, vol.14, no.2