中国机械工程学会生产工程分会知识服务平台

期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2023



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023

2002, vol.14, no.1 2002, vol.14, no.2 2002, vol.14, no.3

题名作者出版年年卷期
Intermetallic morphology around Ni particles in Sn-3.5Ag solderJ. G. Lee; F. Guo; K. N. Subramanian; J. P. Lucas20022002, vol.14, no.2
Effect of reflow profile on wetting and intermetallic formation between Sn/Ag/Cu solder components and printed circuit boardsMinna Arra; Dongkai Shangguan; Eero Ristolainen; Toivo Lepisto20022002, vol.14, no.2
A methodology to establish baseline metrics for assessing the isothermally aging of Sn-Pb solder interconnectsP. T. Vianco; J. A. Rejent20022002, vol.14, no.2
Reliability of tin-lead balled BGAs soldered with lead-free solder pasteSami Tapani Nurmi; Eero Olavi Ristolainen20022002, vol.14, no.2
Solder ball failure mechanisms in plastic ball grid array packagesC. H. Zhong; S. Yi; D. C. Whalley20022002, vol.14, no.2
Degradation of flip-chip-on-glass interconnection with ACF under high humidity and thermal agingC. M. Lawrence Wu; M. L. Chau20022002, vol.14, no.2



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