中国机械工程学会生产工程分会知识服务平台

期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2002, vol.14, no.1 2002, vol.14, no.2 2002, vol.14, no.3

题名作者出版年年卷期
Correlation of solder paste rheology with computational simulations of the stencil printing processR. Durairaj; G. J. Jackson; N. N. Ekere; G. Glinski; C. Bailey20022002, vol.14, no.1
Solder paste reflow modelingS. H. Mannan20022002, vol.14, no.1
Numerical modelling of scanned beam laser soldering of fine pitch packagesP. M. Beckett; A. R. Fleming; J. M. Gilbert; D. G. Whitehead20022002, vol.14, no.1
A simplified model of the reflow soldering processDavid C. Whalley; Stuart M. Hyslop20022002, vol.14, no.1
CFD modelling of the flow field inside a reflow ovenHao Yu; Jorma Kivilathti20022002, vol.14, no.1
Analysis on solder ball shear testing conditions with a simple computational modelS. W. Ricky Lee; Xingjia Huang20022002, vol.14, no.1
Optimisation modelling for flip-chip solder joint reliabilityS. Stoyanov; C. Bailey; M. Cross20022002, vol.14, no.1



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