中国机械工程学会生产工程分会知识服务平台

期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



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1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2003, vol.15, no.1 2003, vol.15, no.2 2003, vol.15, no.3

题名作者出版年年卷期
Contact resistance of metal-coated polymer particles used in anisotropically conductive adhesivesJarmo Maattanen20032003, vol.15, no.1
Reducing bonding cycle time of adhesive flip chip processAnne Seppala; Kati Aalto; Eero Ristolainen20032003, vol.15, no.1
Finite element analysis of a three-dimensional packageZhaowei Zhong; Peng Kiong Yip20032003, vol.15, no.1
The analysis of creep data for solder alloysW. J. Plumbridge20032003, vol.15, no.1
The influence of multiple reflow cycles on solder joint voids for lead-free PBGAsS. T. Nurmi; J. J. Sundelin; E. O. Ristolainen; T. Lepisto20032003, vol.15, no.1
Creep behavior of composite lead-free electronic solder jointsF. Guo; J. Lee; K. N. Subramanian20032003, vol.15, no.1
Fine pitch stencil printing using enclosed printing systemsLing Chunxian Zou; Milos Dusek; Martin Wickham; Christopher Hunt20032003, vol.15, no.1
Advanced alloy for lead-free solder ballsMarc Dittes; Hermann Walter20032003, vol.15, no.1



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