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中国机械工程学会生产工程分会知识服务平台

期刊

ISSN	0954-0911
刊名	Soldering & Surface Mount Technology
参考译名	焊接与表面固定技术
收藏年代	1999～2023

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2023

2003, vol.15, no.1

2003, vol.15, no.2

2003, vol.15, no.3

题名	作者	出版年	年卷期
Contact resistance of metal-coated polymer particles used in anisotropically conductive adhesives	Jarmo Maattanen	2003	2003, vol.15, no.1
Reducing bonding cycle time of adhesive flip chip process	Anne Seppala; Kati Aalto; Eero Ristolainen	2003	2003, vol.15, no.1
Finite element analysis of a three-dimensional package	Zhaowei Zhong; Peng Kiong Yip	2003	2003, vol.15, no.1
The analysis of creep data for solder alloys	W. J. Plumbridge	2003	2003, vol.15, no.1
The influence of multiple reflow cycles on solder joint voids for lead-free PBGAs	S. T. Nurmi; J. J. Sundelin; E. O. Ristolainen; T. Lepisto	2003	2003, vol.15, no.1
Creep behavior of composite lead-free electronic solder joints	F. Guo; J. Lee; K. N. Subramanian	2003	2003, vol.15, no.1
Fine pitch stencil printing using enclosed printing systems	Ling Chunxian Zou; Milos Dusek; Martin Wickham; Christopher Hunt	2003	2003, vol.15, no.1
Advanced alloy for lead-free solder balls	Marc Dittes; Hermann Walter	2003	2003, vol.15, no.1

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