中国机械工程学会生产工程分会知识服务平台

期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2003, vol.15, no.1 2003, vol.15, no.2 2003, vol.15, no.3

题名作者出版年年卷期
Pb-free solder bumping for flip chip package by electroplatingHyeon Hwang; Soon-Min Hong; Jae-Pil Jung; Choon-Sik Kang20032003, vol.15, no.2
Interaction kinetics between PBGA solder balls and Au/Ni/Cu metallisation during laser reflow bumpingYanhong Tian; Chunqing Wang; Xiaodong Zhang; Deming Liu20032003, vol.15, no.2
Process characterization of PCB assembly using 0201 packages with lead-free solderDavid Geiger; Fredrik Mattsson; Dongkai Shangguan; M. T. Ong; Patrick Wong; Mei Wang; Todd Castello; Sammy Yi20032003, vol.15, no.2
The effect of the hot air levelling process on skip solder defects in the wave soldering processTeo Kiat Choon20032003, vol.15, no.2
A novel measurement technique for stencil printed solder pasteMilos Dusek; Christopher Hunt20032003, vol.15, no.2
Study of under bump metallisation barrier layer for lead-free solderK. C. Chan; Z. W. Zhong; K. W. Ong20032003, vol.15, no.2



国家科技图书文献中心  全球文献资源网  京ICP备05055788号-26  京公网安备11010202008970号  机械工业信息研究院 2018-2024