中国机械工程学会生产工程分会知识服务平台

期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2003, vol.15, no.1 2003, vol.15, no.2 2003, vol.15, no.3

题名作者出版年年卷期
Improving the fatigue life of a bare die flip chip by thinningT. Alander; I. Suominen; P. Heino; E. Ristolainen20032003, vol.15, no.3
Flip chip solder joint reliability under harsh environmentCheng Bo; Wang Li; Zhang Qun; Gao Xia; Xie Xiaoming; Wolfgang Kempe20032003, vol.15, no.3
Mechanical characterization of Sn-3.5Ag solder joints at various temperaturesH. Rhee; K. N. Subramanian; A. Lee; J. G. Lee20032003, vol.15, no.3
Failures of flip chip assemblies under thermal shockCheng Bo; Wang Li; Zhang Qun; Gao Xia; Xie Xiaoming; Wolfgang Kempe20032003, vol.15, no.3
Thermal strain analysis of an electronics package using the SEM Moire techniqueZ. W. Zhong; S. K. Nah20032003, vol.15, no.3



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