中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



全部

1995 1996 1997 1998 1999 2000
2001 2002 2003 2004 2005 2006
2007 2008 2009 2010 2011 2012
2013 2014 2015 2016 2017 2018
2019 2020 2021 2022 2023 2024

2005, vol.127, no.1 2005, vol.127, no.2 2005, vol.127, no.3 2005, vol.127, no.4

题名作者出版年年卷期
A New Wafer Level Packaging Approach: Encapsulation, Metallization and Laser Structuring for Advanced System in Package ManufacturingK.-F. Becker; T. Braun; A. Neumann; A. Ostmann; E. Coko; M. Koch; V. Bader; R. Aschenbrenner; H. Reichl20052005, vol.127, no.1
Area-Selective Adhesive Bonding Using Photosensitive BCB for WL CSP ApplicationsA. Polyakov; M. Bartek; J. N. Burghartz20052005, vol.127, no.1
Adhesive Joining Process and Joint Property With Low Melting Point FillerKiyokazu Yasuda; Jong-Min Kim; Kozo Fujimoto20052005, vol.127, no.1
Resin Self-Alignment Processes for Self-Assembly SystemsJong-Min Kim; Kiyokazu Yasuda; Kozo Fujimoto20052005, vol.127, no.1
Optical Fiber Shifts and Shear Stains in V-Groove Arrays for Optical MEMS PackagingZ. W. Zhong; S. C. Lim; A. Asundi20052005, vol.127, no.1
Various Adhesives for Flip ChipsZ. W. Zhong20052005, vol.127, no.1
Finite Thickness Influence on Spherical and Conical Indentation on Viscoelastic Thin Polymer FilmV. Gonda; J. den Toonder; J. Beijer; G. Q. Zhang; L. J. Ernst20052005, vol.127, no.1
PCR Microchip Array Based on Polymer Bonding TechniqueXiaomei Yu; Ting Li; Lin Hao; Dacheng Zhang20052005, vol.127, no.1
Interfacial Adhesion of Anisotropic Conductive Adhesives on Polyimide SubstrateLiqiang Cao; Zonghe Lai; Johan Liu20052005, vol.127, no.1
Experiment and Numerical Analysis of the Residual Stresses in Underfill Resins for Flip Chip Package ApplicationsMan-Lung Sham; Jang-Kyo Kim20052005, vol.127, no.1
12



国家科技图书文献中心  全球文献资源网  京ICP备05055788号-26  京公网安备11010202008970号  机械工业信息研究院 2018-2024