中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2023



全部

1995 1996 1997 1998 1999 2000
2001 2002 2003 2004 2005 2006
2007 2008 2009 2010 2011 2012
2013 2014 2015 2016 2017 2018
2019 2020 2021 2022 2023

2005, vol.127, no.1 2005, vol.127, no.2 2005, vol.127, no.3 2005, vol.127, no.4

题名作者出版年年卷期
Development of Novel Filler Technology for No-Flow and Wafer Level Underfill MaterialsSlawomir Rubinsztajn; Donald Buckley; John Campbell; David Esler; Eric Fiveland; Ananth Prabhakumar; Donna Sherman; Sandeep Tonapi20052005, vol.127, no.2
Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal DeformationWoon-Seong Kwon; Myung-Jin Yim; Kyung-Wook Paik; Suk-Jin Ham; Soon-Bok Lee20052005, vol.127, no.2
Snap-Curing Electrically Conductive Formulation for Solder Replacement ApplicationsAndrzej Moscicki; Jan Felba; Tadeusz Sobierajski; Jozef Kudzia20052005, vol.127, no.2
Reliability of an 1657CCGA (Ceramic Column Grid Array) Package With 95.5SN3.9AG0.6CU Lead-Free Solder Paste on PCBS (Printed Circuit Boards)John Lau; Walter Dauksher20052005, vol.127, no.2
Jet Impingement Cooling of Chips Equipped With Cylindrical Pedestal Profile FinsY. S. Chung; D. H. Lee; P. M. Ligrani20052005, vol.127, no.2
Reliability of Anisotropic Conductive Film Joints Using Bumpless Chip-Influence of Reflow Soldering and Environmental TestingW. K. Chiang; Y. C. Chan20052005, vol.127, no.2
Experimental Study of Void Formation in High-Lead Solder Joints of Flip-Chip AssembliesDaijiao Wang; Ronald L. Panton20052005, vol.127, no.2
Performance of Graphite Foam Evaporator for Use in Thermal ManagementJohnathan S. Coursey; Jungho Kim; Paul J. Boudreaux20052005, vol.127, no.2
Submodeling Analysis for Path-Dependent Thermomechanical ProblemsTong Hong Wang; Yi-Shao Lai20052005, vol.127, no.2
An Experimental and Numerical Study of a Liquid Mixing Device for MicrosystemsKazuyoshi Fushinobu; Masashi Nakata20052005, vol.127, no.2
12



国家科技图书文献中心  全球文献资源网  京ICP备05055788号-26  机械工业信息研究院 2018-2024