中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志;美国机械工程师学会汇刊
收藏年代1995~2024



全部

1995 1996 1997 1998 1999 2000
2001 2002 2003 2004 2005 2006
2007 2008 2009 2010 2011 2012
2013 2014 2015 2016 2017 2018
2019 2020 2021 2022 2023 2024

2005, vol.127, no.1 2005, vol.127, no.2 2005, vol.127, no.3 2005, vol.127, no.4

题名作者出版年年卷期
An Experimental Study of Transient Heat Transfer From Discrete Heat Sources in Water Cooled Vertical Rectangular ChannelH. Bhowmik; K. W. Tou20052005, vol.127, no.3
Dynamics of Board-Level Drop ImpactE. H. Wong20052005, vol.127, no.3
A Damage-Mechanics-Based Constitutive Model for Solder JointsC. Basaran; Y. Zhao; H. Tang; J. Gomez20052005, vol.127, no.3
Analyses of Convection Heat Transfer From Discrete Heat Sources in a Vertical Rectangular ChannelH. Bhowmik; C. P. Tso; K. W. Tou20052005, vol.127, no.3
A Novel Semi-empirical Model for Evaluating Thermal Performance of Porous Metallic Foam Heat SinksTzer-Ming Jeng; Li-Kang Liu; Ying-Huei Hung20052005, vol.127, no.3
Effect of Stress on the Dielectric Constant of AluminaSihai Wen; D. D. L. Chung20052005, vol.127, no.3
Low Cycle Fatigue Testing of Ball Grid Array Solder Joints under Mixed-Mode Loading ConditionsTae-Sang Park; Soon-Bok Lee20052005, vol.127, no.3
Numerical Heat Transfer Predictive Accuracy for an In-Line Array of Board-Mounted Plastic Quad Flat Back Components in Free ConvectionValerie Eveloy; Peter Rodgers; M. S. J. Hashmi20052005, vol.127, no.3
Multiscale Mechanics in Microelectronics: A Paradigm in MiniaturizationM. G. D. Geers; V. Kouznetsova; W. A. M. Brekelmans20052005, vol.127, no.3
A Micromechanics-Based Vapor Pressure Model in Electronic PackagesX. J. Fan; J. Zhou; G. Q. Zhang; L. J. Ernst20052005, vol.127, no.3
123