中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2005, vol.127, no.1 2005, vol.127, no.2 2005, vol.127, no.3 2005, vol.127, no.4

题名作者出版年年卷期
Rapid Temperature Cycling (RTC) Methodology for Reliability Assessment of Solder Interconnection in Tape Ball Grid Array (TBGA) AssemblyB. L. Chen; X. Q. Shi; G. Y. Li; K. H. Ang; Jason P. Pickering20052005, vol.127, no.4
Moisture Absorption and Diffusion Characterization of Molding CompoundXu Chen; Shufeng Zhao; Linda Zhai20052005, vol.127, no.4
Flip-Chip Ball Grid Array Lead-Free Solder Joint Under Reliability TestMing-Hwa R. Jen; Jenq-Dah Wu; Lee-Cheng Liu20052005, vol.127, no.4
Effect of Reversing Heat Flux Direction During Reflow on Void Formation in High-Lead Solder BumpsDaijiao Wang; Ronald L. Panton20052005, vol.127, no.4
Thermal Performance Investigation for Confined Heat Sinks By Using a Modified Transient Liquid Crystal TechniqueMing-Chang Wu; Tiao-Yuan Wu; Sheng-Tzung Kuo; Ying-Huei Hung20052005, vol.127, no.4
Thermal Performance Metrics for Arranging Forced Air Cooled Servers in a Data Processing CabinetJeffrey Rambo; Yogendra Joshi20052005, vol.127, no.4
Board Level Drop Impact - Fundamental and Parametric AnalysisE. H. Wong; Y.-W. Mai; S. K. W. Seah20052005, vol.127, no.4
A Numerical Study of the Enhancement of Chip Cooling via a Flow-Disturbing Obstruction BlockS. Kong Wang; Tzu-Chen Hung; Bau-Shi Pei; An-Fong Chen; Ja-Lin Du20052005, vol.127, no.4
Experimental In Situ Characterization and Creep Modeling of Tin-Based Solder Joints on Commercial Area Array Packages at -40℃, 23℃, and 125℃Ahmad Abu Obaid; Jay G. Sloan; Mark A. Lamontia; Antonio Paesano; Subhotosh Khan; John J. Gillespie, Jr.20052005, vol.127, no.4
Meso Scale Pulsating Jets for Electronics CoolingJivtesh Garg; Mehmet Arik; Stanton Weaver; Todd Wetzel; Seyed Saddoughi20052005, vol.127, no.4
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