中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2006, vol.128, no.1 2006, vol.128, no.2 2006, vol.128, no.3 2006, vol.128, no.4

题名作者出版年年卷期
Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip InterconnectionLiu Caroline Chen; Zonghe Lai; Zhaonian Cheng; Johan Liu20062006, vol.128, no.3
A Model for Assessing the Shape of Solder Joints in the Presence of PCB and Package WarpageMahidhar Rayasam; Terrace B. Thompson; Ganesh Subbarayan; C. Gurumurthy; J. R. Wilcox20062006, vol.128, no.3
An Evaluation of Gold and Copper Wire Bonds on Shear and Pull TestingS. Murali; N. Srikanth; Charles J. Vath III20062006, vol.128, no.3
Experimental Study of Void Formation in Eutectic and Lead-Free Solder Bumps of Flip-Chip AssembliesDaijiao Wang; Ronald L. Panton20062006, vol.128, no.3
Discussion on the Reliability Issues of Solder-Bump and Direct-Solder Bonded Power Device Packages Having Double-Sided Cooling CapabilityJohn G. Bai; Jesus N. Calata; Guo-Quan Lu20062006, vol.128, no.3
Electronics Packaging Cooling: Technologies From Gas Turbine Engine CoolingM. Arik; R. S. Bunker20062006, vol.128, no.3
Study of Flow and Heat Transfer Characteristics in Asymmetrically Heated Sintered Porous Heat Sinks With Periodical BafflesTzer-Ming Jeng; Sheng-Chung Tzeng20062006, vol.128, no.3
Fabrication and Characterization of Flexible Substrates for Use in the Development of Miniaturized Wireless Sensor Network ModulesBivragh Majeed; Kieran Delaney; John Barton; Niall McCarthy; Sean C. O’Mathuna; John Alderman20062006, vol.128, no.3
The Effects of Multiple Zincation Process on Aluminum Bond Pad Surface for Electroless Nickel Immersion Gold DepositionM. K. Md Arshad; I. Ahmad; A. Jalar; G. Omar; U. Hashim20062006, vol.128, no.3
Heightened Thermal Convection as a Result of Splitting a Square Cavity Diagonally in HalfEl Hassan Ridouane; Antonio Campo20062006, vol.128, no.3
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