中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2023



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2006, vol.128, no.1 2006, vol.128, no.2 2006, vol.128, no.3 2006, vol.128, no.4

题名作者出版年年卷期
Viability of Dynamic Cooling Control in a Data Center EnvironmentTimothy D. Boucher; David M. Auslander; Cullen E. Bash; Clifford C. Federspiel; Chandrakant D. Patel20062006, vol.128, no.2
Nanoscale Thermal Phenomena in Tunnel Junctions for Spintronics ApplicationsYongho "Sungtaek" Ju20062006, vol.128, no.2
Micron and Submicron-Scale Characterization of Interfaces in Thermal Interface Material SystemsArun Gowda; David Esler; Sandeep Tonapi; Annita Zhong; K. Srihari; Florian Schattenmann20062006, vol.128, no.2
Rapid Thermal Characterization of the High Thermal Conductivity Film Layers by the Film-on Substrate TechniqueSadegh M. Sadeghipour; Mehdi Asheghi20062006, vol.128, no.2
Investigation of Flow and Heat Transfer of an Impinging Jet in a Cross-Flow For Cooling of a Heated CubeD. Rundstrom; B. Moshfegh20062006, vol.128, no.2
Boiling Heat Transfer Enhancement Using a Submerged, Vibration-Induced JetSteven W. Tillery; Samuel N. Heffington; Marc K. Smith; Ari Glezer20062006, vol.128, no.2
"Heat Shield" - An Enhancement Device for an Unshrouded, Forced Convection Heat SinkSuzana Prstic; Avram Bar-Cohen20062006, vol.128, no.2
Modeling of Natural Convection in Electronic EnclosuresPeter M. Teertstra; M. Michael Yovanovich; J. Richard Culham20062006, vol.128, no.2
An Experimental Study of the Enhancement of Air-Cooling Limits for Telecom/Datacom Heat Sink Applications Using an Impinging Air JetEric Sansoucy; Patrick H. Oosthuizen; Gamal Refai-Ahmed20062006, vol.128, no.2
Thermal Phenomena in Nanoscale TransistorsEric Pop; Kenneth E. Goodson20062006, vol.128, no.2
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