中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2006, vol.128, no.1 2006, vol.128, no.2 2006, vol.128, no.3 2006, vol.128, no.4

题名作者出版年年卷期
A Numerical Analysis of the Thermal Performance of Single Sided and Back-to-Back Tape Ball Grid Array PackagesSandeep S. Tonapi; Sanjeev B. Sathe; Bahgat G. Sammakia; K. Srihari20062006, vol.128, no.4
Optimization Study for a Parallel Plate Impingement Heat SinkAmit Shah; Bahgat G. Sammakia; K. Srihari; K. Ramakrishna20062006, vol.128, no.4
Boron Nitride Particle Filled Paraffin Wax as a Phase-Change Thermal Interface MaterialZongrong Liu; D. D. L. Chung20062006, vol.128, no.4
The Role of Fin Geometry in Heat Sink PerformanceW. A. Khan; J. R. Culham; M. M. Yovanovich20062006, vol.128, no.4
Predicting the Liquid Formation for the Solder Joints in Flip Chip TechnologyWen-Hwa Chen; Shu-Ru Lin; Kuo-Ning Chiang20062006, vol.128, no.4
Prognostics Assessment of Aluminum Support Structure on a Printed Circuit BoardSony Mathew; Diganta Das; Michael Osterman; Michael Pecht; Robin Ferebee20062006, vol.128, no.4
The Exergy Cost of Information Processing: A Comparison of Computer-Based Technologies and Biological SystemsV. P. Carey; A. J. Shah20062006, vol.128, no.4
Optimization of Synthetic Jet Fluidic Structures in Printed Wiring BoardsYong Wang; Guang Yuan; Yong-Kyu Yoon; Mark G. Allen; Sue Ann Bidstrup20062006, vol.128, no.4
An Exergy-Based Figure-of-Merit for Electronic PackagesAmip J. Shah; Van P. Carey; Cullen E. Bash; Chandrakant D. Patel20062006, vol.128, no.4
Thermal Behavior of Nominally Flat Silicon-Based Heat SpreadersTa-Wei Lin; Ming-Chang Wu; Cheng-Hsien Peng; Po-Li Chen; Ying-Huei Hung20062006, vol.128, no.4
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