中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2009, vol.131, no.1 2009, vol.131, no.2 2009, vol.131, no.3 2009, vol.131, no.4

题名作者出版年年卷期
Influence of Power Cycling Durations on Thermal and Fatigue Reliability Characteristics of Board-Level Chip-Scale PackagesTong Hong Wang; Chang-Chi Lee; Yi-Shao Lai; Kuo-Yuan Lee20092009, vol.131, no.1
Influence of Thermomigration on Lead-Free Solder Joint Mechanical PropertiesMohd F. Abdulhamid; Cemal Basaran20092009, vol.131, no.1
Nonlinear Viscoelastic Finite Element Analysis of Physical Aging in an Encapsulated TransformerM. A. Neidigk; Y.-L. Shen20092009, vol.131, no.1
Determination of Optimized Rectangular Spreader Thickness for Lower Thermal Spreading ResistanceYen-Shu Chen; Kuo-Hsiang Chien; Yung-Shin Tseng; Yea-Kuang Chan20092009, vol.131, no.1
Development of Analytical Model to a Temperature Distribution of a First Level Package With a Nonuniformly Powered DieAbhijit Kaisare; Dereje Agonafer; A. Haji-Sheikh; Greg Chrysler; Ravi Mahajan20092009, vol.131, no.1
Integration of Ta-N Thin Film Resistors on Anodic Alumina MCM-D SubstrateDapeng Zhu; Xiaoqin Lin; Le Luo20092009, vol.131, no.1
Correlating Drop Impact Simulations With Drop Impact Testing Using High-Speed Camera MeasurementsJ. J. M. Zaal; W. D. van Driel; F. J. H. G. Kessels; G. Q. Zhang20092009, vol.131, no.1
A General Methodology to Predict Fatigue Life in Lead-Free Solder Alloy InterconnectsDavid M. Pierce; Sheri D. Sheppard; Paul T. Vianco20092009, vol.131, no.1
Thermal Stresses Due to Laser Welding in Bridge-Wire InitiatorsMichael R. Maughan; Robert R. Stephens; Donald M. Blackketter; Karl K. Rink20092009, vol.131, no.1
Characterization of Chemical Cure Shrinkage of Epoxy Molding Compound With Application to Warpage AnalysisGuojun Hu; Jing-En Luan; Spencer Chew20092009, vol.131, no.1
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