中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2023



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2009, vol.131, no.1 2009, vol.131, no.2 2009, vol.131, no.3 2009, vol.131, no.4

题名作者出版年年卷期
Tensile Behaviors of Lead-Containing and Lead-Free Solders at High Strain RatesFei Qin; Tong An; Na Chen; Jie Bai20092009, vol.131, no.3
Effect of Leadframe Oxidation on the Reliability of a Quad Flat No-Lead PackageS. Abdullah; M. F. Abdullah; A. K. Ariffin; A. Jalar20092009, vol.131, no.3
In Situ Chip Stress Extractions for LFBGA Packages Through Piezoresistive SensorsBen-Je Lwo; Jeng-Shian Su; Hsien Chung20092009, vol.131, no.3
Thermal Analysis of Miniature Low Profile Heat Sinks With and Without FinsV. Egan; P. A. Walsh; E. Walsh; R. Grimes20092009, vol.131, no.3
Effect of Warpage of Flip Chip Packages Due to the Underfill Encapsulating Process on Interconnect ReliabilitySatoru Katsurayama; Hironori Tohmyoh20092009, vol.131, no.3
Laser-Based Target Preparation in 3D Integrated Electronic PackagesStefan Martens; Walter Mack; Frederic Courtade; Philippe Perdu; Juergen Wilde; Friedemann Voelklein20092009, vol.131, no.3
Squeezing Flow of a Power Law Fluid Between Grooved PlatesDrew A. Davidson; Bahgat G. Sammakia20092009, vol.131, no.3
Experimental Investigation and Theoretical Model for Subcooled Flow Boiling Pressure Drop in MicroChannel Heat SinksJaeseon Lee; Issam Mudawar20092009, vol.131, no.3
Multiple Fan-Heat Sink Cooling System With Enhanced Evaporator Base: Design, Modeling, and ExperimentPablo D. Quinones; Lawrence S. Mok20092009, vol.131, no.3
Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process - Part I: Theory and Numerical ImplementationB. Xie; X. J. Fan; X. Q. Shi; H. Ding20092009, vol.131, no.3
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