中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2009, vol.131, no.1 2009, vol.131, no.2 2009, vol.131, no.3 2009, vol.131, no.4

题名作者出版年年卷期
Simulation study on the influences of the bonding parameters on the warpage of chip-on-glass module with nonconductive filmJianhua Zhang; Fang Yuan; Jinsong Zhang20092009, vol.131, no.4
Fabrication of Miniature CMOS Image Sensor Using Novel Glass Cover Chip Packaging TechniqueChuen-Ching Wang; Yao-Ting Ye; Jing-Fung Lin20092009, vol.131, no.4
Novel Design of Thermal-Via Configurations for Collector-Up HBTsPei-Hsuan Lee; Hsien-Cheng Tseng; Jung-Hua Chou20092009, vol.131, no.4
A Novel Ceramic Packaging Technique Using Selective Induction HeatingSheng Liu; Wenming Liu; Changyong Lin; Mingxiang Chen20092009, vol.131, no.4
Improved Solder Joint Fatigue Models Through Reduced Geometry Dependence of Empirical FitsD. Bhate; G. Subbarayan; J. Zhao; V. Gupta; D. Edwards20092009, vol.131, no.4
Thermal and Structural Analysis of a Suspended Physics Package for a Chip-Scale Atomic ClockA. D. Laws; R. Berwick III; P. Stupar; J. DeNatale; Y. C. Lee20092009, vol.131, no.4
Finite Element Modeling of Simultaneous Ultrasonic Bumping With Au BallsWan Ho Song; Ali Karimi; Yan Huang; Michael Mayer; Norman Zhou; Jae Pil Jung20092009, vol.131, no.4
A Modified Flip-Chip LED Packaging Design With Enhanced Light Coupling Efficiency for Plastic Optical Fiber NetworksChuen-Ching Wang; Wen-Ran Yang; Jin-Jia Chen; Wei-Wen Shi20092009, vol.131, no.4
Numerical Simulation of Thermal Conductivity of Particle Filled Epoxy CompositesJun Zeng; Renli Fu; Simeon Agathopoulos; Shaodong Zhang; Xiufeng Song; Hong He20092009, vol.131, no.4
Measurement of Leak Rate for MEMS Vacuum PackagingZhiyin Gan; Dexiu Huang; Xuetang Wang Dong Lin; Sheng Liu20092009, vol.131, no.4
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