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期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2023



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2012, vol.134, no.1 2012, vol.134, no.2 2012, vol.134, no.3 2012, vol.134, no.4

题名作者出版年年卷期
Characterization of Metallically Bonded Carbon Nanotube-Based Thermal Interface Materials Using a High Accuracy 1D Steady-State TechniqueJoseph R. Wasniewski; David H. Altman; Stephen L. Hodson; Timothy S. Fisher; Anuradha Bulusu; Samuel Graham; Baratunde A. Cola20122012, vol.134, no.2
Evaluation of Joining Strength of Silicon-Resin Interface at a Vertex in a Three-Dimensional Joint StructureHideo Koguchi; Kazuhisa Hoshi20122012, vol.134, no.2
Thermal Stresses of Through Silicon Vias and Si Chips in Three Dimensional System in PackageTakahiro Kinoshita; Takashi Kawakami; Tatsuhiro Hori; Keiji Matsumoto; Sayuri Kohara; Yasumitsu Orii; Fumiaki Yamada; Morihiro Kada20122012, vol.134, no.2
Optimization of Enclosed Aisle Data Centers Using Bypass RecirculationDustin W. Demetriou; H. Ezzat Khalifa20122012, vol.134, no.2
Effect of Design Parameters on Drop Test Performance of Wafer Level Chip Scale PackagesP. Tumne; V. Venkatadri; S. Kudtarkar; M. Delaus; D. Santos; R. Havens; K. Srihari20122012, vol.134, no.2
An Overview of the IBM Power 775 Supercomputer Water Cooling SystemMichael J. Ellsworth; Gary F. Goth; Randy J. Zoodsma; Amilcar Arvelo; Levi A. Campbell; William J. Anderl20122012, vol.134, no.2
Numerical Simulations of Electromigration and Stressmigration Driven Void Evolution in Solder InterconnectsSubramanya Sadasiva; Ganesh Subbarayan; Lei Jiang; Daniel Pantuso20122012, vol.134, no.2
Prognostication Based on Resistance-Spectroscopy and Phase-Sensitive Detection for Electronics Subjected to Shock-ImpactPradeep Lall; Ryan Lowe; Kai Goebel20122012, vol.134, no.2
Influences of Solder Wetting on Self-Alignment Accuracy and Modeling for Optoelectronic Devices AssemblyMing Kong; Sungeun Jeon; Chiwon Hwang; Y. C. Lee20122012, vol.134, no.2
Vacuum Packaging of MEMS by Self-AssemblyRoyi Naveh; Eyal Zussman20122012, vol.134, no.2
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