中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志;美国机械工程师学会汇刊
收藏年代1995~2024



全部

1995 1996 1997 1998 1999 2000
2001 2002 2003 2004 2005 2006
2007 2008 2009 2010 2011 2012
2013 2014 2015 2016 2017 2018
2019 2020 2021 2022 2023 2024

2012, vol.134, no.1 2012, vol.134, no.2 2012, vol.134, no.3 2012, vol.134, no.4

题名作者出版年年卷期
Characterization of Metallically Bonded Carbon Nanotube-Based Thermal Interface Materials Using a High Accuracy 1D Steady-State TechniqueJoseph R. Wasniewski; David H. Altman; Stephen L. Hodson; Timothy S. Fisher; Anuradha Bulusu; Samuel Graham; Baratunde A. Cola20122012, vol.134, no.2
Evaluation of Joining Strength of Silicon-Resin Interface at a Vertex in a Three-Dimensional Joint StructureHideo Koguchi; Kazuhisa Hoshi20122012, vol.134, no.2
Thermal Stresses of Through Silicon Vias and Si Chips in Three Dimensional System in PackageTakahiro Kinoshita; Takashi Kawakami; Tatsuhiro Hori; Keiji Matsumoto; Sayuri Kohara; Yasumitsu Orii; Fumiaki Yamada; Morihiro Kada20122012, vol.134, no.2
Optimization of Enclosed Aisle Data Centers Using Bypass RecirculationDustin W. Demetriou; H. Ezzat Khalifa20122012, vol.134, no.2
Effect of Design Parameters on Drop Test Performance of Wafer Level Chip Scale PackagesP. Tumne; V. Venkatadri; S. Kudtarkar; M. Delaus; D. Santos; R. Havens; K. Srihari20122012, vol.134, no.2
An Overview of the IBM Power 775 Supercomputer Water Cooling SystemMichael J. Ellsworth; Gary F. Goth; Randy J. Zoodsma; Amilcar Arvelo; Levi A. Campbell; William J. Anderl20122012, vol.134, no.2
Numerical Simulations of Electromigration and Stressmigration Driven Void Evolution in Solder InterconnectsSubramanya Sadasiva; Ganesh Subbarayan; Lei Jiang; Daniel Pantuso20122012, vol.134, no.2
Prognostication Based on Resistance-Spectroscopy and Phase-Sensitive Detection for Electronics Subjected to Shock-ImpactPradeep Lall; Ryan Lowe; Kai Goebel20122012, vol.134, no.2
Influences of Solder Wetting on Self-Alignment Accuracy and Modeling for Optoelectronic Devices AssemblyMing Kong; Sungeun Jeon; Chiwon Hwang; Y. C. Lee20122012, vol.134, no.2
Vacuum Packaging of MEMS by Self-AssemblyRoyi Naveh; Eyal Zussman20122012, vol.134, no.2
12