中国机械工程学会生产工程分会知识服务平台
主页
文献资源
外文期刊
外文会议
中文期刊
专业机构
生产工程
智能制造
高级检索
关于我们
版权声明
使用帮助
期刊
ISSN
1043-7398
刊名
Journal of Electronic Packaging
参考译名
电子封装杂志;美国机械工程师学会汇刊
收藏年代
1995~2024
全部
1995
1996
1997
1998
1999
2000
2001
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2012, vol.134, no.1
2012, vol.134, no.2
2012, vol.134, no.3
2012, vol.134, no.4
题名
作者
出版年
年卷期
Characterization of Metallically Bonded Carbon Nanotube-Based Thermal Interface Materials Using a High Accuracy 1D Steady-State Technique
Joseph R. Wasniewski; David H. Altman; Stephen L. Hodson; Timothy S. Fisher; Anuradha Bulusu; Samuel Graham; Baratunde A. Cola
2012
2012, vol.134, no.2
Evaluation of Joining Strength of Silicon-Resin Interface at a Vertex in a Three-Dimensional Joint Structure
Hideo Koguchi; Kazuhisa Hoshi
2012
2012, vol.134, no.2
Thermal Stresses of Through Silicon Vias and Si Chips in Three Dimensional System in Package
Takahiro Kinoshita; Takashi Kawakami; Tatsuhiro Hori; Keiji Matsumoto; Sayuri Kohara; Yasumitsu Orii; Fumiaki Yamada; Morihiro Kada
2012
2012, vol.134, no.2
Optimization of Enclosed Aisle Data Centers Using Bypass Recirculation
Dustin W. Demetriou; H. Ezzat Khalifa
2012
2012, vol.134, no.2
Effect of Design Parameters on Drop Test Performance of Wafer Level Chip Scale Packages
P. Tumne; V. Venkatadri; S. Kudtarkar; M. Delaus; D. Santos; R. Havens; K. Srihari
2012
2012, vol.134, no.2
An Overview of the IBM Power 775 Supercomputer Water Cooling System
Michael J. Ellsworth; Gary F. Goth; Randy J. Zoodsma; Amilcar Arvelo; Levi A. Campbell; William J. Anderl
2012
2012, vol.134, no.2
Numerical Simulations of Electromigration and Stressmigration Driven Void Evolution in Solder Interconnects
Subramanya Sadasiva; Ganesh Subbarayan; Lei Jiang; Daniel Pantuso
2012
2012, vol.134, no.2
Prognostication Based on Resistance-Spectroscopy and Phase-Sensitive Detection for Electronics Subjected to Shock-Impact
Pradeep Lall; Ryan Lowe; Kai Goebel
2012
2012, vol.134, no.2
Influences of Solder Wetting on Self-Alignment Accuracy and Modeling for Optoelectronic Devices Assembly
Ming Kong; Sungeun Jeon; Chiwon Hwang; Y. C. Lee
2012
2012, vol.134, no.2
Vacuum Packaging of MEMS by Self-Assembly
Royi Naveh; Eyal Zussman
2012
2012, vol.134, no.2
1
2
国家科技图书文献中心
全球文献资源网
京ICP备05055788号-26
京公网安备11010202008970号 机械工业信息研究院 2018-2024