中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志;美国机械工程师学会汇刊
收藏年代1995~2023



全部

1995 1996 1997 1998 1999 2000
2001 2002 2003 2004 2005 2006
2007 2008 2009 2010 2011 2012
2013 2014 2015 2016 2017 2018
2019 2020 2021 2022 2023

2012, vol.134, no.1 2012, vol.134, no.2 2012, vol.134, no.3 2012, vol.134, no.4

题名作者出版年年卷期
A Multiphysics Finite Element Model of a 35A Automotive Connector Including Multiscale Rough Surface ContactSantosh V. Angadi; Robert L. Jackson; Song-yul Choe; George T. Flowers; Bong-Yi Lee; Liang Zhong20122012, vol.134, no.1
Thermal Energy Storage Thermal Response Model With Application to Thermal Management of High Power-Density Hand-Held ElectronicsR. A. Wirtz; K. Swanson; M. Yaquinto20122012, vol.134, no.1
Influence of Gap Height in Flip Chip Underfill Process With Non-Newtonian Flow Between Two Parallel PlatesC. Y. Khor; M. Z. Abdullah; M. Abdul Mujeebu20122012, vol.134, no.1
Performance of Axial Fans in Close Proximity to the Electromagnetic Compatibility ScreensR. Anton; A. Bengoechea; A. Rivas; J. C. Ramos; G. S. Larraona20122012, vol.134, no.1
Optimization of Heating Temperature History for Anisotropic Conductive Film InterconnectionYasutada Nakagawa; Ryohei Yokoyama20122012, vol.134, no.1
Comparison Between Numerical and Experimental Results of Airflow Distribution in Diffuser Based Data CenterQifei Jian; Qiaoli Wang; Haoting Wang; Zheng Zuo20122012, vol.134, no.1
An Experimental and Computational Study on Moisture Induced Epoxy Swelling in Non-hermetic Optoelectronic PackagesSushma Madduri; William Infantolino; Bahgat G. Sammakia20122012, vol.134, no.1
Performance Study of a 980 nm GaAs Based Laser Diode Chip in a Moisture Condensing EnvironmentSushma Madduri; Bahgat G. Sammakia; William Infantolino; Satish C. Chaparala; Lawrence C. Hughes; J. Micheal Harris20122012, vol.134, no.1
Interconnect Joule Heating under Transient Currents using the Transmission Line Matrix MethodBanafsheh Barabadi; Yogendra K. Joshi; Satish Kumar; Gamal Refai-Ahmed20122012, vol.134, no.1
Effects of Corner/Edge Bonding and Underfill Properties on the Thermal Cycling Performance of Lead Free Ball Grid Array AssembliesP. Borgesen; D. Blass; M. Meilunas20122012, vol.134, no.1
12