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期刊
ISSN
1043-7398
刊名
Journal of Electronic Packaging
参考译名
电子封装杂志;美国机械工程师学会汇刊
收藏年代
1995~2024
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2014, vol.136, no.1
2014, vol.136, no.2
2014, vol.136, no.3
2014, vol.136, no.4
题名
作者
出版年
年卷期
Analytical Solutions and a Numerical Approach for Diffusion-Induced Stresses in Intermetallic Compound Layers of Solder Joints
Tong An; Fei Qin; Guofeng Xia
2014
2014, vol.136, no.1
Performance of Hybrid Fin Heat Sinks for Thermal Control of Light Emitting Diode Lighting Modules
Kyoung Joon Kim
2014
2014, vol.136, no.1
Comparison of Ball Pull Strength Among Various Sn-Cu-Ni Solder Joints With Different Pad Surface Finishes
Chaoran Yang; Fubin Song; S. W. Ricky Lee
2014
2014, vol.136, no.1
A Compact Modeling Approach to Enhance Collaborative Design of Thermal-Fluid Systems
Jason Stafford; David Newport; Ronan Grimes
2014
2014, vol.136, no.1
Heterogeneous Void Nucleation Study in Flip Chip Assembly Process Using No-Flow Underfill
Sangil Lee; Daniel F. Baldwin
2014
2014, vol.136, no.1
The Strength of High-Temperature Ag-In Joints Produced Between Copper by Fluxless Low-Temperature Processes
Yuan-Yun Wu; Chin C. Lee
2014
2014, vol.136, no.1
A New Accurate Closed-Form Analytical Solution for Junction Temperature of High-Powered Devices
J. H. L. Ling; A. A. O. Tay
2014
2014, vol.136, no.1
Investigation of Multiple Miniature Axial Fan Cooling Solutions and Thermal Modeling Approaches
Jason Stafford; Florian Fortune
2014
2014, vol.136, no.1
Thermally Conductive and Highly Electrically Resistive Grease Through Homogeneously Dispersing Liquid Metal Droplets Inside Methyl Silicone Oil
Shengfu Mei; Yunxia Gao; Zhongshan Deng; Jing Liu
2014
2014, vol.136, no.1
Optimization of a Hybrid Double-Side Jet Impingement Cooling System for High-Power Light Emitting Diodes
Sun-Min Kim; Kwang-Yong Kim
2014
2014, vol.136, no.1
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