中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



全部

1995 1996 1997 1998 1999 2000
2001 2002 2003 2004 2005 2006
2007 2008 2009 2010 2011 2012
2013 2014 2015 2016 2017 2018
2019 2020 2021 2022 2023 2024

2015, vol.137, no.1 2015, vol.137, no.2 2015, vol.137, no.3 2015, vol.137, no.4

题名作者出版年年卷期
Effect of Crystallographic Quality of Grain Boundaries on Both Mechanical and Electrical Properties of Electroplated Copper Thin Film InterconnectionsMurata, Naokazu; Saito, Naoki; Suzuki, Ken; Miura, Hideo; Tamakawa, Kinji20152015, vol.137, no.3
Thermo-Fluid-Stress-Deformation Analysis of Two-Layer Microchannels for Cooling Chips With Hot SpotsAbdoli, Abas; Dulikravich, George S.; Vasquez, Genesis; Rastkar, Siavash20152015, vol.137, no.3
Ohmic Curing of Three-Dimensional Printed Silver Interconnects for Structural ElectronicsRoberson, David A.; Wicker, Ryan B.; MacDonald, Eric20152015, vol.137, no.3
Mixed Array of Compliant Interconnects to Balance Mechanical and Electrical CharacteristicsOkereke, R. I.; Sitaraman, S. K.20152015, vol.137, no.3
Influence of Glass Transition Temperature of Underfill on the Stress Behavior and Reliability of Microjoints Within a Chip Stacking ArchitectureChang, Jing-Yao; Huang, Shin-Yi; Lee, Chang-Chun; Chuang, Tung-Han; Chang, Tao-Chih20152015, vol.137, no.3
Hot Spot Cooling and Harvesting Central Processing Unit Waste Heat Using Thermoelectric ModulesLee, Soochan; Phelan, Patrick E.; Wu, Carole-Jean20152015, vol.137, no.3
Transient Response of an Oscillating Heat Pipe by a Pulsed Heating in a High Magnetic Field EnvironmentSmoot, C. D.; Hathaway, A. A.; Ma, H. B.; Crawford, M. T.; Huhman, B. M.; Sobel, Annie20152015, vol.137, no.3
Multiphysics Analysis for Temperature Rise of Electronic Connectors Using a Multiscale ModelLiao, K. -C.; Lu, H. -L.20152015, vol.137, no.3
Subcooled Boiling Heat Transfer for Cooling of Power Electronics in Hybrid Electric VehiclesZhao, Weihuan; France, David M.; Yu, Wenhua; Singh, Dileep20152015, vol.137, no.3
Double-Sided Transferred Carbon Nanotube Arrays for Improved Thermal Interface MaterialsMcNamara, Andrew J.; Joshi, Yogendra; Zhang, Zhuomin; Moon, Kyoung-Sik; Lin, Ziyin; Yao, Yagang; Wong, Ching-Ping; Lin, Wei20152015, vol.137, no.3
12



国家科技图书文献中心  全球文献资源网  京ICP备05055788号-26  京公网安备11010202008970号  机械工业信息研究院 2018-2024