中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2023



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2015, vol.137, no.1 2015, vol.137, no.2 2015, vol.137, no.3 2015, vol.137, no.4

题名作者出版年年卷期
Effect of Crystallographic Quality of Grain Boundaries on Both Mechanical and Electrical Properties of Electroplated Copper Thin Film InterconnectionsMurata, Naokazu; Saito, Naoki; Suzuki, Ken; Miura, Hideo; Tamakawa, Kinji20152015, vol.137, no.3
Thermo-Fluid-Stress-Deformation Analysis of Two-Layer Microchannels for Cooling Chips With Hot SpotsAbdoli, Abas; Dulikravich, George S.; Vasquez, Genesis; Rastkar, Siavash20152015, vol.137, no.3
Ohmic Curing of Three-Dimensional Printed Silver Interconnects for Structural ElectronicsRoberson, David A.; Wicker, Ryan B.; MacDonald, Eric20152015, vol.137, no.3
Mixed Array of Compliant Interconnects to Balance Mechanical and Electrical CharacteristicsOkereke, R. I.; Sitaraman, S. K.20152015, vol.137, no.3
Influence of Glass Transition Temperature of Underfill on the Stress Behavior and Reliability of Microjoints Within a Chip Stacking ArchitectureChang, Jing-Yao; Huang, Shin-Yi; Lee, Chang-Chun; Chuang, Tung-Han; Chang, Tao-Chih20152015, vol.137, no.3
Hot Spot Cooling and Harvesting Central Processing Unit Waste Heat Using Thermoelectric ModulesLee, Soochan; Phelan, Patrick E.; Wu, Carole-Jean20152015, vol.137, no.3
Transient Response of an Oscillating Heat Pipe by a Pulsed Heating in a High Magnetic Field EnvironmentSmoot, C. D.; Hathaway, A. A.; Ma, H. B.; Crawford, M. T.; Huhman, B. M.; Sobel, Annie20152015, vol.137, no.3
Multiphysics Analysis for Temperature Rise of Electronic Connectors Using a Multiscale ModelLiao, K. -C.; Lu, H. -L.20152015, vol.137, no.3
Subcooled Boiling Heat Transfer for Cooling of Power Electronics in Hybrid Electric VehiclesZhao, Weihuan; France, David M.; Yu, Wenhua; Singh, Dileep20152015, vol.137, no.3
Double-Sided Transferred Carbon Nanotube Arrays for Improved Thermal Interface MaterialsMcNamara, Andrew J.; Joshi, Yogendra; Zhang, Zhuomin; Moon, Kyoung-Sik; Lin, Ziyin; Yao, Yagang; Wong, Ching-Ping; Lin, Wei20152015, vol.137, no.3
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