中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2015, vol.137, no.1 2015, vol.137, no.2 2015, vol.137, no.3 2015, vol.137, no.4

题名作者出版年年卷期
Multiple Quality Characteristics Optimization of Ball Grid Array Wire Bonding ProcessYih-Fong, Tzeng; Fu-Chen, Chen; Chih-Huang, Chen20152015, vol.137, no.4
Temporary Bonding/Debonding of Silicon Substrates Based on Propylene CarbonateZhu, Zhiyuan; Yu, Min; Liu, Lisha; Jin, Yufeng20152015, vol.137, no.4
Nanothermal Interface Materials: Technology Review and Recent ResultsBar-Cohen, Avram; Matin, Kaiser; Narumanchi, Sreekant20152015, vol.137, no.4
A Brief Overview of Recent Developments in Thermal Management in Data CentersAlkharabsheh, Sami; Fernandes, John; Gebrehiwot, Betsegaw; Agonafer, Dereje; Ghose, Kanad; Ortega, Alfonso; Joshi, Yogendra; Sammakia, Bahgat20152015, vol.137, no.4
Measurement of Air Flow Rate Sensitivity to the Differential Pressure Across a Server Rack in a Data CenterArghode, Vaibhav K.; Joshi, Yogendra20152015, vol.137, no.4
A Review of Two-Phase Forced Cooling in Three-Dimensional Stacked Electronics: Technology IntegrationGreen, Craig; Kottke, Peter; Han, Xuefei; Woodrum, Casey; Sarvey, Thomas; Asrar, Pouya; Zhang, Xuchen; Joshi, Yogendra; Fedorov, Andrei; Sitaraman, Suresh; Bakir, Muhannad20152015, vol.137, no.4
Size-Compatible, Polymer-Based Air-Gap Formation Processes, and Polymer Residue Analysis for Wafer-Level MEMS Packaging ApplicationsUzunlar, Erdal; Kohl, Paul A.20152015, vol.137, no.4
Effect of Intermetallic Compounds on the Thermomechanical Fatigue Life of Three-Dimensional Integrated Circuit Package Microsolder Bumps: Finite Element Analysis and StudyChoudhury, Soud Farhan; Ladani, Leila20152015, vol.137, no.4
Impact Isolation Through the Use of Compliant Interconnects for Microelectronic PackagesChen, Wei; Bhat, Anirudh; Sitaraman, Suresh K.20152015, vol.137, no.4
Natural Convection Immersion Cooling With Enhanced Optical Performance of Light-Emitting Diode SystemsTamdogan, Enes; Arik, Mehmet20152015, vol.137, no.4



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