中国机械工程学会生产工程分会知识服务平台

期刊


ISSN0018-9219
刊名Proceedings of the IEEE
参考译名电气与电子工程师学会会报
收藏年代1998～2013



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2006, vol.94, no.1 2006, vol.94, no.10 2006, vol.94, no.11 2006, vol.94, no.12 2006, vol.94, no.2 2006, vol.94, no.3
2006, vol.94, no.4 2006, vol.94, no.5 2006, vol.94, no.6 2006, vol.94, no.7 2006, vol.94, no.8 2006, vol.94, no.9

题名作者出版年年卷期
Wafer Direct Bonding: From Advanced Substrate Engineering to Future Applications in Micro/NanoelectronicsSILKE H. CHRISTIANSEN; RAJENDRA SINGH; ULRICH GOSELE20062006, vol.94, no.12
Substrate Noise Coupling in SoC Design: Modeling, Avoidance, and ValidationALI AFZALI-KUSHA; MAKOTO NAGATA; NISHATH K. VERGHESE; DAVID J. ALLSTOT20062006, vol.94, no.12
A Survey on Mix Networks and Their Secure ApplicationsKRISHNA SAMPIGETHAYA; RADHA POOVENDRAN20062006, vol.94, no.12



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