中国机械工程学会生产工程分会知识服务平台

期刊


ISSN0018-9219
刊名Proceedings of the IEEE
参考译名电气与电子工程师学会会报
收藏年代1998～2013



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2006, vol.94, no.1 2006, vol.94, no.10 2006, vol.94, no.11 2006, vol.94, no.12 2006, vol.94, no.2 2006, vol.94, no.3
2006, vol.94, no.4 2006, vol.94, no.5 2006, vol.94, no.6 2006, vol.94, no.7 2006, vol.94, no.8 2006, vol.94, no.9

题名作者出版年年卷期
Cooling a Microprocessor Chip: Heat spreading, choice of thermal interface materials, and proper heat-sink design can enhance cooling of microprocessor packages and systemsRAVI MAHAJAN; CHIA-PIN CHIU; GREG CHRYSLER20062006, vol.94, no.8
Thermal Modeling, Analysis, and Management in VLSI Circuits: Principles and Methods: Maximum chip performance under peak permissible temperature limits may be achieved with the help of combined electrical and thermal simulation of VLSI circuitsMASSOUD PEDRAM; SHAHIN NAZARIAN20062006, vol.94, no.8
Temperature-Aware Placement for SOCs: High and uneven temperatures can be avoided when appropriate thermal modeling and simulation are incorporated in placement algorithms for components and interconnections in systems-on-chipJENG-LIANG TSAI; CHARLIE CHUNG-PING CHEN; GUOQIANG CHEN; BRENT GOPLEN; HAIFENG QIAN; YONG ZHAN; SUNG-MO (STEVE) KANG; MARTIN D. F. WONG; SACHIN S. SAPATNEKAR20062006, vol.94, no.8
Dynamic Surface Temperature Measurements in ICs: High-sensitivity, high-resolution thermal mapping of integrated circuits can be provided by techniques such as scanning with laser beams and embedding of CMOS temperature sensorsJOSEP ALTET; WILFRID CLAEYS; STEFAN DILHAIRE; ANTONIO RUBIO20062006, vol.94, no.8
On-Chip Thermal Management With Microchannel Heat Sinks and Integrated Micropumps: Coolant liquid could be moved through tiny channels on chip surfaces if suitably small and powerful pumps were developed and incorporated into these channelsSURESH V. GARIMELLA; VISHAL SINGHAL; DONG LIU20062006, vol.94, no.8
Direct Liquid Cooling of High Flux Micro and Nano Electronic Components: Boiling, evaporation, jet, and spray cooling, by suitable liquids such as fluorocarbons, might serve to control chip hot-spots and overheatingAVRAM BAR-COHEN; MEHMET ARIK; MICHAEL OHADI20062006, vol.94, no.8
Thermal Interface Materials: Historical Perspective, Status, and Future DirectionsRAVI PRASHER20062006, vol.94, no.8
Heat Generation and Transport in Nanometer-Scale Transistors: Heat problems in ever-smaller integrated circuits include hot-spots at transistor drain areas, reduced heat conduction in new devices and higher thermal resistance at material boundariesERIC POP; SANJIV SINHA; KENNETH E. GOODSON20062006, vol.94, no.8
Overview of Solid-State Thermoelectric Refrigerators and Possible Applications to On-Chip Thermal ManagementJEFF SHARP; JIM BIERSCHENK; HYLAN B. LYON, JR.20062006, vol.94, no.8
Nanoscale Thermal Transport and Microrefrigerators on a Chip: Devices for cooling high power density and dynamic hot spots can be formed by solid-state thin films on the chip, or they could be buried in, bonded to, or mounted on substratesALI SHAKOURI20062006, vol.94, no.8



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