中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2023



全部

1995 1996 1997 1998 1999 2000
2001 2002 2003 2004 2005 2006
2007 2008 2009 2010 2011 2012
2013 2014 2015 2016 2017 2018
2019 2020 2021 2022 2023

2018, vol.140, no.1 2018, vol.140, no.2 2018, vol.140, no.3 2018, vol.140, no.4

题名作者出版年年卷期
Hybrid Nanocomposite Thermal Interface Materials: The Thermal Conductivity and the Packing DensityZhang, Tingling; Sammakia, Bahgat G.; Yang, Zhihao; Wang, Howard20182018, vol.140, no.3
A Wire-Bondless Packaging Platform for Silicon Carbide Power Semiconductor DevicesYin, Liang; Kapusta, Christopher; Gowda, Arun; Nagarkar, Kaustubh20182018, vol.140, no.3
Embedded Two-Phase Cooling of High Flux Electronics Via Press-Fit and Bonded FEEDS CoolersMandel, Raphael K.; Bae, Daniel G.; Ohadi, Michael M.20182018, vol.140, no.3
Edge Trimming Induced Defects on Direct Bonded WafersLnoue, Fumihiro; Jourdain, Anne; Peng, Lan; Phommahaxay, Alain; Kosemura, Daisuke; De Wolf, Ingrid; Rebibis, Kenneth June; Miller, Andy; Sleeckx, Erik; Beyne, Eric20182018, vol.140, no.3
Fabrication of Multimeasurand Sensor for Monitoring of a Li-ton BatteryKnobloch, Aaron; Kapusta, Chris; Karp, Jason; Plotnikov, Yuri; Siegel, Jason B.; Stefanopoulou, Anna G.20182018, vol.140, no.3
Interfacial Compounds Characteristic and Its Reliability Effects on SAC305 Microjoints in Flip Chip AssembliesTian, Ye; Ren, Ning; Jian, Xiaoxia; Geng, Tie; Wu, Yiping20182018, vol.140, no.3
Effect of Long-Term Room Temperature Aging on the Fatigue Properties of SnAgCu Solder JointSu, Sinan; Fu, Nianjun; Akkara, Francy John; Hamasha, Sa'd20182018, vol.140, no.3
Development of a High Cycle Fatigue Life Prediction Model for Thin Film Silicon StructuresChang, Chia-Cheng; Lin, Sheng-Da; Chiang, Kuo-Ning20182018, vol.140, no.3
Modeling of Moisture Transport Into an Electronic Enclosure Using the Resistor-Capacitor ApproachStaliulionis, Z.; Conseil-Gudla, H.; Mohanty, S.; Jabbari, M.; Ambat, R.; Hattel, J. H.20182018, vol.140, no.3



国家科技图书文献中心  全球文献资源网  京ICP备05055788号-26  机械工业信息研究院 2018-2024