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期刊
ISSN
0913-5685
刊名
電子情報通信学会技術研究報告
参考译名
电子信息通信学会技术研究报告:可靠性
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2019, vol.119, no.10
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题名
作者
出版年
年卷期
Role of electroless-Ni plating in high-aspect-ratio TSV fabrication for 3D integration and packaging
Murugesan Mariappan; Takafumi Fukushima
2019
2019, vol.119, no.410
High-precision Dual Damascene Fabrication Technique
Y. Iizuka; Y. Kikuchi; K. Maekawa; M. Fujikawa; T. Yamaguchi; S. Nozawa; H. Kawasaki
2019
2019, vol.119, no.410
Nanophotonics contributions to state-of-the-art CMOS Image Sensors
Sozo YOKOGAWA
2019
2019, vol.119, no.410
BTA-H_2O_2溶液中Cu, Co表面の保護膜形成に関する考察
近藤英一; 遠山真央; 竹内翔太; 金蓮花; 小篠涼太; 濱田聡美; 嶋昇平; 檜山浩國
2019
2019, vol.119, no.410
[招待講演]強誘電体Hf_(0.5)Zr_(0.5)O_2膜中へ単層Si挿入により均一埋設したAlナノクラスタが強誘電体トランジスタの閾値電圧ばらつきに与える効果
山口直; 前川径一; 大原隆裕; 天羽生淳; 佃栄次; 園田賢一郎; 柳田博史; 井上真雄; 山下朋弘; 松浦正純
2019
2019, vol.119, no.410
CMP後洗浄後の銅配線表面の安定性: 銅配線上の異常成長とその要因
河瀬康弘; 柴田俊明; 草野智博; 原田憲; 竹下寛
2019
2019, vol.119, no.410
[招待講演]真空紫外光を用いた印刷·めっきによる配線技術
三成剛生; Wanli Li; Qingqing Sun; Lingying Li; Xuying Liu; 金原正幸
2019
2019, vol.119, no.410
[招待講演]異種デバイスの高密度実装用極薄接合材料
茅場靖剛; 中村雄三; 鎌田潤; 河関孝志; 高村一夫
2019
2019, vol.119, no.410
マイクロ熱電発電素子のための低熱抵抗金属/絶縁体積層薄膜の開発
詹天卓; 馬帥哲; 金志成; 武澤宏樹; 目崎航平; 富田基裕; 呉彦儒; 徐一斌; 渡邉孝信
2019
2019, vol.119, no.410
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