中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2023



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2023, vol.145, no.1 2023, vol.145, no.2 2023, vol.145, no.3

题名作者出版年年卷期
Reviewer's Recognition 20232023, vol.145, no.2
A Transient Resistance/Capacitance Network-Based Model for Heat Spreading in Substrate Stacks Having Multiple Anisotropic LayersBandyopadhyay, Soumya; Weibel, Justin A.20232023, vol.145, no.2
Process Development for Printed Copper With Surface Mount Devices on Inkjet MetallizationLall, Pradeep; Goyal, Kartik; Hill, Curtis20232023, vol.145, no.2
Failure Mechanisms Driven Reliability Models for Power Electronics: A ReviewGabriel, Okafor Ekene; Huitink, David Ryan20232023, vol.145, no.2
Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain ConditionsMontazeri, Mahsa; Vinson, Whit M.; Huitink, David R.20232023, vol.145, no.2
An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic–Plastic Problems of Multiscale Structures in Electronic PackagingQin, Fei; He, Qi; Gong, Yanpeng; Hou, Chuantao; Cheng, Hao; An, Tong; Dai, Yanwei; Chen, Pei20232023, vol.145, no.2
Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load OperationCheng, Hsien-Chie; Liu, Yan-Cheng20232023, vol.145, no.2
Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure DevicesDey, Shuv; Jimenez, Luis Diego Monge; Brown, J. Michael; Joshi, Yogendra20232023, vol.145, no.2
Experimental and Numerical Investigation of Electromigration Behavior of Printed Silver Wire Under High Current DensityZhang, Haibin; Sun, Quan; Sun, Zhidan; Lu, Yebo20232023, vol.145, no.2
Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure AnalysisWei, Xin; Belhadi, Mohamed El Amine; Hamasha, Sa'd; Alahmer, Ali; Zhao, Rong; Prorok, Bart; Sakib, A. R. Nazmus20232023, vol.145, no.2
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