中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志;美国机械工程师学会汇刊
收藏年代1995~2023



全部

1995 1996 1997 1998 1999 2000
2001 2002 2003 2004 2005 2006
2007 2008 2009 2010 2011 2012
2013 2014 2015 2016 2017 2018
2019 2020 2021 2022 2023

2023, vol.145, no.1 2023, vol.145, no.2 2023, vol.145, no.3

题名作者出版年年卷期
Investigation of Electromechanical Reliability and Radio Frequency Performance of a Highly Stretchable Liquid Metal Conductor for Wearable ElectronicsGarakani, Behnam; Somarathna, Udara S.; Umar, Ashraf; Khinda, Gurvinder Singh; Abdelatty, Mohamed Youssef M.; Abbara, El Mehdi; Al Zerey, Sari; Srinivas, Sai; Kinzel, Chuck; Halseth, Christopher; Ronay, Mark; Poliks, Mark D.; Hopkins, Mike20232023, vol.145, no.3
High Gain and Wideband Antenna-in-Package Solution Using Fan-Out TechnologyZhang, Xuesong; Wang, Qian; Xia, Chenhui; Zhou, Chaojie; Wang, Gang; Cai, Jian20232023, vol.145, no.3
Study on the Microstructure Evolution and Mechanical Properties of Cu/Cu41Sn11/Cu Solder Joint During High-Temperature AgingYang, Gangli; Li, Xiaoyan; Zhang, Hu; Wen, Linjie; Li, Shanshan; Han, Xu20232023, vol.145, no.3
Model Establishment of Chip Air Cooling Process and Its Proportional Integral Differential TuningXu, Linmeng; Zhao, Wanying; Li, Junhui20232023, vol.145, no.3
Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics ApplicationsAlzoubi, Khalid; Hensel, Alexander; Haeussler, Felix; Ottinger, Bettina; Sippel, Marcel; Franke, Joerg20232023, vol.145, no.3
Mandrel Bend Test of Screen-Printed Silver ConductorsChen, Rui; Chow, Justin; Zhou, Yi; Sitaraman, Suresh K.20232023, vol.145, no.3
Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and OpportunitiesParet, Paul; Finegan, Donal; Narumanchi, Sreekant20232023, vol.145, no.3
Numerical Study of Two-Stage Temperature Control Strategy for High-Temperature Stability of Satellite-Borne Fiber Optic GyroscopeChang, Kaifeng; Li, Yun-Ze; Wang, Weishu20232023, vol.145, no.3
Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled ApproachesHamasha, Sa'd; Alahmer, Ali; Belhadi, Mohamed El Amine; Wei, Xin20232023, vol.145, no.3
Numerical Analysis of Flow and Heat Transfer Characteristics of Lattice-Based Compact Heat SinksKaur, Inderjot; Mujahid, Shiraz; Paudel, YubRaj; Rhee, Hongjoo; Singh, Prashant20232023, vol.145, no.3
12