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期刊

ISSN	0913-5685
刊名	電子情報通信学会技術研究報告
参考译名	电子信息通信学会技术研究报告：可靠性
收藏年代	2000～2023

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题名	作者	出版年	年卷期
15μm-pitch Bump Interconnections Relied on Flip-chip Bonding Technique - for Advanced Chip Stacking Applications	Masahiro AOYAGI; Thanh-Tung BUI; Fumiki KATO; Naoya WATANABE; Shunsuke NEMOTO; Katsuya KIKUCHI	2013	2013, vol.113, no.451
三次元積層向けウェハの裏面研削によるダメージ評価	水島賢子; 金永ソク; 中村友二; 杉江隆一; 橋本秀樹; 上殿明良; 大場隆之	2013	2013, vol.113, no.451
大口径中性粒子ビームCVDを用いたノンポーラスULK-SiOCH膜	菊地良幸; 寒川誠二	2013	2013, vol.113, no.451
TSVの高速形成に向けた有機系導電インクの注入手法	川喜多仁	2013	2013, vol.113, no.451
集積回路のこれから－社会の動きを考えてみる	益一哉	2013	2013, vol.113, no.451
インプラント法によるカーボンナノチューブプラグの作製とスパッタアニール法による多層グラフェン配線の接合	佐藤元伸; 高橋慎; 二瓶瑞久; 佐藤信太郎; 横山直樹	2013	2013, vol.113, no.451
導電性下地上でのカーボンナノチューブの低温·稠密成長	野田優; 羅ヌリ; 白井聖; 野村桂甫; 長谷川馨	2013	2013, vol.113, no.451
気相堆積重合ポリイミドを用いたTSVライナー形成	福島誉史; マリアッパンムルゲサン; 裴志哲; 李康旭; 小柳光正	2013	2013, vol.113, no.451
先端Low-k配線技術における課題と指針	井上尚也	2013	2013, vol.113, no.451