中国机械工程学会生产工程分会知识服务平台

期刊


ISSN0946-7076
刊名Microsystem technologies
参考译名微系统技术：传感器，致动器与系统集成
收藏年代1998～2023

关联期刊参考译名收藏年代
Journal of Information Storage and Processing Systems存储与处理系统信息杂志2000～2001


全部

1998 1999 2000 2001 2002 2003
2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2014 2015
2016 2017 2018 2019 2020 2021
2022 2023

2005, vol.11, no.1 2005, vol.11, no.11 2005, vol.11, no.12 2005, vol.11, no.2-3 2005, vol.11, no.4-5 2005, vol.11, no.6
2005, vol.11, no.7 2005, vol.11, no.8-10 2005, vol.12, no.1-2

题名作者出版年年卷期
Super-fine ink-jet printing: toward the minimal manufacturing systemKazuhiro Murata; Junichi Matsumoto; Akira Tezuka; Yorishige Matsuba; Hiroshi Yokoyama20052005, vol.12, no.1-2
Experimental measurements and behavioral modeling of an electrostatically actuated bi-axial micromirrorFabien Parrain; Souhil Megherbi; Gilles Raynaud; Herve Mathias; Jean-Paul Gilles; Alain Bosseboeuf; Gerold Schropfer; Nicolas Faure; Pierre Cusin20052005, vol.12, no.1-2
V-shaped micromechanical tunable capacitors for RF applicationsAurelie Gruau; Gaelle Lissorgues; Pierre Nicole; Dominique Placko; Adrian M. Ionescu20052005, vol.12, no.1-2
A methodology to extract dynamic compact thermal models under time-varying boundary conditions: application to a thermopile based IR sensorM. Salleras; J. Palacin; M. Moreno; J. Santander L. Fonseca; J. Samitier; S. Marco20052005, vol.12, no.1-2
Fabrication and optimization of bimorph micro probes for the measurement of individual biocellsY. H. Cho; D. Collard; L. Buchaillot; F. Conseil; B. J. Kim20052005, vol.12, no.1-2
Behavioral VHDL-AMS model and experimental validation of a nuclear magnetic resonance sensorS. Megherbi; J.-C. Ginefri; L. Darrasse; G. Raynaud; J.-F. Pone20052005, vol.12, no.1-2
Electronic Mosquito: designing a semi-invasive Microsystem for blood sampling, analysis and drug delivery applicationsGiorgio E. Gattiker; Karan V. I. S. Kaler; Martin P. Mintchev20052005, vol.12, no.1-2
MOEMS: packaging and testingZ. F. Wang; W. Cao; Z. Lu20052005, vol.12, no.1-2
Mechanical and electrical bonding between silicon wafer and glass wafer with etched channels containing metal tracksS. Brida; S. Metivet; D. Petit; O. Stojanovic20052005, vol.12, no.1-2
Glass frit bonding: an universal technology for wafer level encapsulation and packagingRoy Knechtel20052005, vol.12, no.1-2
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