中国机械工程学会生产工程分会知识服务平台

期刊


ISSN0946-7076
刊名Microsystem technologies
参考译名微系统技术：传感器，致动器与系统集成
收藏年代1998～2023

关联期刊参考译名收藏年代
Journal of Information Storage and Processing Systems存储与处理系统信息杂志2000～2001


全部

1998 1999 2000 2001 2002 2003
2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2014 2015
2016 2017 2018 2019 2020 2021
2022 2023

2015, vol.21, no.1 2015, vol.21, no.10 2015, vol.21, no.11 2015, vol.21, no.12 2015, vol.21, no.2 2015, vol.21, no.3
2015, vol.21, no.4 2015, vol.21, no.5 2015, vol.21, no.6 2015, vol.21, no.7 2015, vol.21, no.8 2015, vol.21, no.9

题名作者出版年年卷期
Conductivity of high-temperature annealed silicon direct wafer bondsPoppe, Erik; Wang, Dag T.; Schjolberg-Henriksen, Kari; Tvedt, Lars Geir Whist; Gjelstad, Stein Are; Mork, Christopher; Moe, Sigurd T.; Imenes, Kristin20152015, vol.21, no.5
Origin of the TTV of thin films obtained by temporary bonding ZoneBond(A (R)) technologyMontmeat, P.; Enot, T.; Pellat, M.; Fournel, F.; Bally, L.; Baud, L.; Dechamp, J.; Eleouet, R.; Vignoud, L.; Zussy, M.20152015, vol.21, no.5
Kinetics of low temperature direct copper-copper bondingGondcharton, P.; Imbert, B.; Benaissa, L.; Carron, V.; Verdier, M.20152015, vol.21, no.5
Analytical methods used for low temperature Cu-Cu wafer bonding process evaluationRebhan, B.; Tollabimazraehno, S.; Hesser, G.; Dragoi, V.20152015, vol.21, no.5
UV/O-3 assisted InP/Al2O3-Al2O3/Si low temperature die to wafer bondingAnantha, P.; Tan, C. S.20152015, vol.21, no.5
Wafer level vacuum packaging of micro-mirrors with buried signal linesLanga, S.; Drabe, C.; Herrmann, A.; Ludewig, T.; Rieck, A.; Flemming, A.; Kaden, C.20152015, vol.21, no.5
Silicon-ceramic-silicon-wafercompound fabricated by using nanostructured silicon surfaces and a ceramic with adapted thermal expansion coefficientGuenschmann, S.; Fischer, M.; Mannebach, H.; Steffensky, J.; Mueller, J.20152015, vol.21, no.5
Laser welding of sapphire wafers using a thin-film fresnoite glass solderde Pablos-Martin, Araceli; Ebert, M.; Patzig, C.; Krause, M.; Dyrba, M.; Miclea, P.; Lorenz, M.; Grundmann, M.; Hoeche, Th20152015, vol.21, no.5
Design of compact and wide bandwidth SPDT with anti-stiction torsional RF MEMS series capacitive switchBansal, Deepak; Kumar, Amit; Sharma, Akshdeep; Rangra, K. J.20152015, vol.21, no.5
Fabrication and characterization of MEMS piezoelectric synthetic jet actuators with bulk-micromachined PZT thick filmWang, Shushan; Ma, Binghe; Deng, Jinjun; Qu, Hongdong; Luo, Jian20152015, vol.21, no.5
12345



国家科技图书文献中心  全球文献资源网  京ICP备05055788号-26  机械工业信息研究院 2018-2024